Wafer Feature Mapping for Adaptive Measurement Point Selection

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Solution Overview

Problem

Existing measurement methods struggle to adapt to pattern changes due to dimension variations, making it difficult to perform accurate measurements in semiconductor manufacturing processes.

Innovation Solution

A system and method that calculates an in-plane distribution of feature data on a wafer, selects new measurement points based on this distribution, and performs measurements at these points to optimize the measurement process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If measurement points are selected in advance based on design data, then measurement process is simple, but measurement accuracy deteriorates when pattern dimensions vary from design

Engineering Contradiction:

Improvemeasurement process simplicityVSAvoidmeasurement accuracy

Core Design Contradiction:

Ease of manufactureVSMeasurement precision

Solution Approach 1:

The system performs preliminary actions by calculating the in-plane distribution of feature data before selecting measurement points. This preliminary calculation enables the system to adapt to actual pattern variations while maintaining an efficient measurement process, resolving the contradiction between process simplicity and measurement accuracy.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The system implements feedback by using the calculated in-plane distribution to select new measurement points dynamically. This feedback mechanism allows the measurement system to adapt to pattern dimension variations, ensuring measurement accuracy while maintaining process efficiency through automated point selection based on actual measured data.

Inventive Principle:

Principle #23Feedback

2Measurement precision

If measurement points are increased to capture pattern variations, then measurement accuracy improves, but measurement time and cost increase

Engineering Contradiction:

Improvemeasurement accuracyVSAvoidmeasurement time

Core Design Contradiction:

Measurement precisionVSLoss of time

Solution Approach 1:

The system applies local quality by selecting measurement points based on the calculated in-plane distribution, focusing measurements on regions where pattern variations are most significant. This approach improves measurement accuracy by concentrating resources on critical areas rather than uniformly distributing measurement points, thereby reducing overall measurement time.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The system performs partial action by selecting only the necessary number of measurement points based on the in-plane distribution calculation, rather than measuring all possible locations. This partial measurement approach captures essential pattern variations while significantly reducing measurement time and resources compared to comprehensive full-wafer measurement.

Inventive Principle:

Principle #16Partial or excessive action

3Productivity

If fixed measurement points are used, then measurement process is efficient, but adaptability to pattern changes is poor

Engineering Contradiction:

Improvemeasurement efficiencyVSAvoidadaptability to pattern changes

Core Design Contradiction:

ProductivityVSAdaptability or versatility

Solution Approach 1:

The system implements dynamics by making measurement point selection adaptive rather than fixed. The in-plane distribution calculation and new measurement point selection process enables the system to dynamically adjust measurement locations based on actual pattern variations, maintaining measurement efficiency through automated selection while improving adaptability to different pattern conditions.

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The system applies parameter changes by modifying measurement point locations based on the calculated in-plane distribution of feature data. This parameter adjustment allows the measurement system to adapt to pattern changes while maintaining efficiency, as the new measurement points are automatically selected based on quantitative analysis of the in-plane distribution rather than arbitrary or fixed positions.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS12422380B2Measurement method, measurement system, and non-transitory computer readable medium

Publication Date: 2025.09.23 HITACHI HIGH TECH CORP

AI summary

An object is to provide a measurement system or the like that enables selection of appropriate new measurement targets by performing measurement on a limited number of measurement points.Proposed is a system including a measurement tool; and a computer system configured to communicate with the measurement tool, in which the computer system is configured to calculate, based on feature data of a plurality of locations on a wafer received from the measurement tool, an in-plane distribution of the feature data on the wafer (C), select, based on the calculated in-plane distribution, a new measurement point for acquiring the feature data (D), calculate, based on feature data acquired by measuring the selected new measurement point (B), a new in-plane distribution of the feature data on the wafer (F), and output at least one of the feature data of the new measurement point and the in-plane distribution which are acquired by executing the selection of the new measurement point and the calculation of the new in-plane distribution at least once (H).