Water-Repellent Wafer Film Chemistry for Pattern Collapse Prevention
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Solution Overview
Problem
The increasing complexity of semiconductor wafer configurations and the need for a water-repellent protective film to prevent pattern collapses during cleaning processes, while avoiding adverse effects from chlorine-containing compounds and requiring no protective film formation-promoting components.
Innovation Solution
A water-repellent protective film-forming agent and liquid chemical using guanidine or amidine derivatives as silicon compounds without chlorine atoms, combined with an organic solvent, to form a protective film on silicon element-containing wafers, reducing capillary forces and preventing pattern collapses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If chlorosilane compounds are used to form water-repellent protective films, then good water repellency is achieved, but adverse effects occur on the wafer due to chlorine atoms
Solution Approach 1:
The invention extracts and removes the harmful chlorine atom from the silane compound structure. Instead of using chlorosilane (Si-Cl), the patent employs silane compounds with hydroxyl groups (Si-OH) that can form water-repellent protective films without introducing chlorine contaminants to the wafer surface.
Solution Approach 2:
The invention changes the chemical parameter of the silane compound from chlorine-containing to hydroxyl-containing. This parameter change maintains the film-forming capability while eliminating the harmful chlorine effect on the wafer.
2Reliability
If conventional water-repellent protective film-forming liquid chemicals are used, then pattern collapse prevention is achieved, but the liquid chemical composition is limited and requires protective film formation-promoting components
Solution Approach 1:
The invention creates a universal water-repellent protective film-forming liquid chemical based on silane compounds with hydroxyl groups that can be applied to various wafer configurations. The liquid chemical formulation achieves pattern collapse prevention without requiring additional protective film formation-promoting components, making it versatile and adaptable to different semiconductor manufacturing scenarios.
3Manufacturing precision
If cleaning processes are performed to remove particles and metal impurities, then wafer cleanliness is improved, but pattern collapses occur due to gas-liquid interface passage through high aspect ratio patterns
Solution Approach 1:
The invention applies a water-repellent protective film to the wafer surface before the cleaning process. This preliminary action creates a protective barrier that prevents pattern collapse during subsequent cleaning operations, allowing the cleaning process to proceed effectively without causing damage to high aspect ratio patterns.
Solution Approach 2:
The water-repellent protective film acts as a cushioning layer that protects the pattern structure from the harmful effects of gas-liquid interface passage during cleaning. This beforehand cushioning prevents the mechanical stress that would otherwise cause pattern collapse.
4Manufacturing precision
If water-based cleaning liquids are used for cleaning, then effective particle and impurity removal is achieved, but the surface must be dried which can cause pattern collapse
Solution Approach 1:
The water-repellent protective film is applied before the water-based cleaning and drying processes. This preliminary action allows the wafer to undergo water-based cleaning followed by drying without causing pattern collapse, as the protective film prevents the mechanical stress that would otherwise occur during drying.
Solution Approach 2:
The water-repellent protective film serves as an intermediary layer between the water-based cleaning liquid and the pattern structure. It allows the cleaning process to proceed effectively while mediating the drying process to prevent pattern collapse.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively forms a water-repellent film on silicon wafers, reducing capillary forces and preventing pattern collapses, while offering a versatile option for various wafer configurations without the need for chlorine-containing compounds or additional promoting components, thus enhancing manufacturing yield and process efficiency.
Implementation Method 1
a water-repellent protective film-forming agent for forming a water-repellent protective film on a silicon element-containing surface of a wafer
Implementation Method 2
on the assumption that water is retained in the recess portion of the silicon wafer surface which has been made water repellent by treatment with the water-repellant cleaning liquid, the silicon wafer surface exhibits a capillary force of 2.1 MN/m2 or less
Data Source
AI summary
The present invention is directed to a novel water-repellent protective film-forming agent and a novel water-repellent protective film-forming liquid chemical, each of which is for forming a water-repellent protective film on a silicon element-containing surface of a wafer, and a method of surface-treating a wafer with the use of the agent in liquid form or the liquid chemical. The water-repellent protective film-forming agent according to the present invention includes at least one kind of silicon compound selected from the group consisting of guanidine derivatives of the following general formula [1] and amidine derivatives of the following general formula [2].