Wafer Storage Fin Structure With Vacuum Binding for Clean Transport
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Solution Overview
Problem
Semiconductor wafer storage devices face challenges in maintaining humidity and contamination control, leading to defects and reduced production yield due to moisture and particle contamination during transport and storage.
Innovation Solution
The storage device incorporates fin structures with protrusions and binding devices, such as padding layers with vacuum suction or clips, to securely hold wafers in place, preventing displacement and contamination during transport.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If wafers are stored in a conventional storage device during transport, then storage capacity is maintained, but wafer stability deteriorates leading to displacement and contamination
Solution Approach 1:
The storage device is divided into multiple compartments, each containing individual fin structures with protrusions. Each fin structure independently holds a single wafer, providing localized stability control rather than relying on a single centralized support structure. This segmentation allows each wafer to be individually stabilized against displacement and contamination.
Solution Approach 2:
Binding devices (clips or suction mechanisms) act as intermediaries between the fin structures and the wafers. These binding devices securely attach wafers to the fin structures during transport, preventing wafer displacement while allowing easy release when binding is no longer needed. The intermediary binding device solves the contradiction by providing stable attachment without permanent fixation.
2Reliability
If binding devices are added to improve wafer stability, then particle contamination is reduced, but device complexity increases
Solution Approach 1:
The binding mechanism utilizes controllable parameters - either magnetic field strength (for magnetic clips) or vacuum pressure (for suction mechanisms). By adjusting these parameters, the binding force can be optimized to provide adequate holding strength during transport while allowing easy release when needed. This parameter-based control achieves high reliability without requiring complex mechanical locking systems.
Solution Approach 2:
Suction mechanisms utilize vacuum pressure to bind wafers to fin structures during transport. This pneumatic approach provides reliable wafer holding through pressure differential, preventing displacement and contamination. The vacuum binding can be easily activated and deactivated by controlling the vacuum source, providing high reliability with relatively simple device architecture.
3Object-affected harmful factors
If conventional storage methods are used, then device complexity is minimized, but humidity control effectiveness deteriorates leading to moisture contamination
Solution Approach 1:
The storage device is divided into multiple compartments with individual fin structures, creating separated micro-environments for each wafer. This segmentation allows better control of humidity and moisture exposure for each individual wafer, preventing moisture contamination through improved isolation from humid external environments.
Solution Approach 2:
The enclosed compartments formed by the fin structures create protected environments that can be filled with inert or controlled atmosphere gas. This inert environment shielding prevents moisture and particle contamination by isolating wafers from harmful external factors during transport and storage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances wafer stability and reduces particle contamination, thereby improving the overall production yield by minimizing defects caused by moisture and particle exposure.
Implementation Method 1
a padding layer configured to provide a vacuum to hold the wafer over the protrusion
Data Source
AI summary
The present disclosure describes a method for substrate storage. The method can include respectively placing a plurality of substrates into a plurality of slots formed by a plurality of fin structures on a panel of a storage device. The method can further include binding each of the plurality of substrates to an corresponding one of the plurality of fin structures. The method can further include moving the storage device from a first location to a second location. The method can further include un-binding the plurality of substrates from the plurality of fin structures.