Wafer Flipper With Retractable Pins and Slip Ring Integration
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Solution Overview
Problem
Existing semiconductor flippers are limited in accommodating multiple sizes and shapes of semiconductor work products, requiring frequent replacement and increased complexity with multiple pneumatic tubing and electrical wiring, which leads to potential failures and alignment issues.
Innovation Solution
A flipper design with retractable alignment pins and a gripper system that accommodates different sizes and shapes, using a single air/vacuum supply and slip ring for power, reducing complexity and increasing alignment precision, allowing for accurate positioning and operation without stopping the EFEM.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If existing flippers support only one type of medium, then the device structure is simple, but the adaptability to different medium sizes and shapes is poor
Solution Approach 1:
The flipper incorporates retractable alignment pins that can extend or retract based on the medium size being processed. This dynamic adjustment allows the same flipper structure to accommodate multiple medium sizes without requiring physical replacement of the entire device, resolving the contradiction between adaptability and structural simplicity
Solution Approach 2:
The flipper is designed with a universal structure that can handle multiple types of media (different sizes and shapes) through the use of adjustable alignment pins and configurable gripper positions. This multi-functional design eliminates the need for multiple dedicated flippers for different medium types, maintaining structural simplicity while achieving high adaptability
2Adaptability or versatility
If multiple pneumatic tubing and electrical wiring are used to accommodate different medium sizes, then the adaptability improves, but the device complexity and potential for failures increase
Solution Approach 1:
The system uses dynamically adjustable alignment pins and gripper positions controlled by a programmable logic controller (PLC) rather than multiple fixed pneumatic and electrical connections for each medium size. This reduces the number of physical connections while maintaining adaptability, thereby improving reliability
Solution Approach 2:
The invention replaces complex mechanical pneumatic tubing and electrical wiring systems with a programmable control system that manages the retractable pins and gripper through software configuration. This substitution reduces physical complexity and potential failure points while maintaining full adaptability to different medium sizes
3Adaptability or versatility
If multiple pneumatic tubing and electrical wiring are used, then the adaptability improves, but the device complexity increases
Solution Approach 1:
The flipper employs dynamically reconfigurable alignment pins and gripper positions that are controlled electronically through a PLC, eliminating the need for multiple dedicated pneumatic and electrical connections for each medium size. This dynamic control approach maintains adaptability while significantly reducing physical system complexity
Solution Approach 2:
A single universal flipper structure with programmable control serves multiple medium sizes and shapes, replacing what would otherwise require multiple specialized flippers with extensive pneumatic and electrical infrastructure. This universal design achieves high adaptability with minimal physical complexity
4Device complexity
If a single air/vacuum supply and slip ring are used, then the device complexity is reduced, but the power delivery capability to rotating parts may be limited
Solution Approach 1:
The system uses a single slip ring for electrical power delivery combined with a single centralized air/vacuum supply that dynamically routes pneumatic power to the rotating gripper and alignment pins through rotary joints. This dynamic resource allocation provides sufficient power capability while minimizing the number of separate supply lines, thus reducing complexity without sacrificing power delivery
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the flipper to handle various sizes and shapes of semiconductor work products with reduced mechanical and electrical complexity, increasing the mean time between failures and improving alignment precision, thus enhancing the semiconductor processing efficiency.
Implementation Method 1
a slip ring for providing electrical power from the support to the rotating assembly
Implementation Method 2
a rotary joint to provide a feed and return connections to the rotating assembly
Data Source
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AI summary
A wafer flipping device for use in semiconductor processing, comprises a supported rotating assembly that receives a semiconductor work product on one side when in a first unrotated position, grips and aligns the work product, rotates with the semiconductor work product thereon into a rotated position, and releases the semiconductor work product from the rotated, position. The semiconductor work product may be any one of a range of different shapes and sizes and retractable pins are selected for the corresponding shape or size.