Wafer-Based Fluid Ejection Device With Reduced Component Count
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Solution Overview
Problem
The manufacturing of fluid ejection devices, such as ink-jet printheads, is costly and prone to precision issues due to the assembly of multiple pre-machined components, leading to variations in device performance and reproducibility.
Innovation Solution
A method involving the coupling of two semiconductor wafers, one with a piezoelectric actuator and outlet channel, and the other with a recess and inlet channels, to form a fluid ejection device with improved alignment and reduced manufacturing complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If multiple pre-machined components are assembled to form a fluid ejection device, then device functionality is achieved, but manufacturing cost increases and manufacturing precision deteriorates due to alignment difficulties
Solution Approach 1:
The patent combines multiple pre-machined components (first component with piezoelectric actuator, second component with chamber, third component with nozzle) into a single integrated fluid ejection device. This merging eliminates the need for separate assembly operations, thereby reducing manufacturing cost and avoiding alignment precision issues that arise from assembling multiple components.
2Ease of manufacture
If multiple pre-machined components are assembled to form a fluid ejection device, then device functionality is achieved, but device thickness increases
Solution Approach 1:
The patent integrates the piezoelectric actuator, fluid chamber, and nozzle into a single monolithic component formed from one piece of piezoelectric material. This merging eliminates the need for stacking multiple separate components, thereby achieving device functionality while minimizing device thickness.
3Ease of manufacture
If components are manufactured separately and assembled, then manufacturing flexibility is maintained, but reproducibility deteriorates due to variations in assembly precision
Solution Approach 1:
The patent forms the entire fluid ejection device as a single integrated component using piezoelectric material processing techniques. This merging eliminates assembly operations entirely, ensuring that every device is manufactured with identical geometric parameters and material properties, thereby achieving perfect reproducibility of ejection volume and ejection rate across all devices.
4Productivity
If wafer coupling methods are used to manufacture fluid ejection devices, then device functionality is achieved, but manufacturing precision deteriorates due to misalignment between wafers
Solution Approach 1:
The patent processes the entire fluid ejection device as a single wafer or monolithic piece of piezoelectric material, eliminating the need to couple multiple wafers together. This approach maintains high manufacturing efficiency while completely avoiding alignment precision issues that arise from wafer coupling operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces manufacturing costs, enhances precision, and ensures uniformity in fluid ejection performance by simplifying the assembly process and minimizing misalignment risks, resulting in a more reliable and solid device.
Implementation Method 1
A piezoelectric actuator is formed on a first side of the first wafer
Data Source
AI summary
Various embodiments provide an ejection device for a fluid. The ejection device includes a first semiconductor wafer, housing, on a first side thereof, a piezoelectric actuator and an outlet channel for the fluid alongside the piezoelectric actuator; a second semiconductor wafer having, on a first side thereof, a recess and, on a second side thereof opposite to the first side, at least one inlet channel for said fluid fluidically coupled to the recess; and a dry-film coupled to a second side, opposite to the first side, of the first wafer. The first and the second wafers are coupled together so that the piezoelectric actuator and the outlet channel are set directly facing, and completely contained in, the recess that forms a reservoir for the fluid. The dry-film has an ejection nozzle.