Wafer Frame Alignment Verification for Correct Processing Conditions
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Solution Overview
Problem
The existing wafer processing machines face errors in selecting appropriate processing conditions, leading to potential damage to wafers and machine malfunctions due to the similarity of stored conditions and the complexity of selecting the correct set for specific wafer specifications.
Innovation Solution
A wafer processing method and machine that utilizes a frame unit comprising a wafer, adhesive tape, and a ring frame with notches, where the positional relationship between the wafer mark and ring frame notches is aligned according to stored processing conditions, displaying a representative image to verify the correctness of the selected conditions before processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple sets of processing conditions are stored in the processing machine, then the machine can process various wafers under appropriate conditions, but the operator may select wrong conditions due to similarity between stored sets
Solution Approach 1:
The patent creates a representative image that is a visual copy or representation of the actual wafer and frame unit configuration. This representative image is stored in association with each set of processing conditions and displayed to the operator during selection, allowing the operator to verify the correctness of the selected conditions by comparing the representative image with the actual wafer configuration, thereby preventing wrong selection among similar processing conditions
Solution Approach 2:
The system provides visual feedback by displaying the representative image corresponding to the selected processing conditions. This feedback mechanism allows the operator to confirm whether the selected conditions match the actual wafer configuration before execution, creating a verification loop that prevents erroneous processing
2Ease of operation
If the operator manually selects processing conditions from stored sets, then flexibility in condition selection is achieved, but errors occur due to complexity and similarity of stored conditions
Solution Approach 1:
A representative image copying the actual wafer-mark and frame-notch configuration is generated and stored with each processing condition set. During operation, the corresponding representative image is displayed to the operator, enabling visual verification that maintains manual selection flexibility while ensuring accurate matching between selected conditions and actual wafer configuration
Solution Approach 2:
The representative image provides visual differentiation through graphical representation, allowing operators to easily distinguish between different processing condition configurations. The visual display of mark-notch alignment relationships enables quick identification and verification of the correct processing conditions
Data Source
AI summary
In a processing method for a wafer with a mark formed in an outer peripheral portion thereof, a frame unit having the wafer, a tape, and a ring frame is provided, a set of processing conditions for processing the wafer is selected, and a representative image associated with the set of processing conditions is displayed on a display unit. The ring frame includes a notch formed in an outer periphery thereof. In the frame unit, the mark and the notch are in a positional relationship set in accordance with the set of processing conditions. The positional relationship is presented in the representative image.