Wafer Frame End Effector Centering via Bernoulli Nozzles
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Solution Overview
Problem
Existing end effectors for wafer frames struggle with precise and reliable centering, especially when handling wafer frames with carrier films, due to the need for precise alignment and structural complexity, leading to instability and increased maintenance in semiconductor production.
Innovation Solution
The use of Bernoulli nozzles for non-contact holding and movement of the wafer frame, combined with an adjustable stop mechanism that moves from an initial position to a centering position, ensures reliable centering and secure holding, even with positional deviations, and the integration of vacuum nozzles for stable fixation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional vacuum nozzles and rigid stop elements are used for holding and centering the wafer frame, then the wafer frame can be held and centered, but extremely precise guidance of the gripper is required and slight positional deviations cause the wafer frame to wedge between stop elements, preventing secure holding
Solution Approach 1:
The patent replaces the traditional mechanical contact-based holding system with a magnetic field-based holding system. The holder generates a magnetic field that interacts with ferromagnetic particles embedded in the wafer frame, enabling contactless holding and positioning. This substitution eliminates the need for extremely precise mechanical guidance and allows the wafer frame to be held reliably even with slight positional deviations, as the magnetic field can adapt to position variations.
Solution Approach 2:
The patent changes the physical state and properties of the holding mechanism by introducing ferromagnetic particles into the wafer frame and using a magnetic field instead of mechanical contact. The holder's magnetic field strength and distribution can be adjusted to accommodate different positional deviations, thereby improving the ease of operation and positional tolerance while maintaining reliable holding.
2Manufacturing precision
If multiple adjusting pins and stop elements are used for centering the wafer frame, then centering can be achieved, but the device complexity increases and maintenance requirements increase
Solution Approach 1:
The patent replaces complex mechanical centering devices with multiple adjusting pins and stop elements with a simplified magnetic field-based centering system. The holder generates a magnetic field that automatically centers the wafer frame by interacting with the ferromagnetic particles, eliminating the need for complex mechanical centering mechanisms and reducing device complexity while maintaining centering precision.
Solution Approach 2:
The magnetic field-based centering system is self-adjusting and does not require manual intervention or complex mechanical adjustments. The ferromagnetic particles in the wafer frame automatically align with the magnetic field generated by the holder, achieving precise centering without the need for multiple adjusting pins or stop elements, thereby reducing device complexity and maintenance requirements.
3Manufacturing precision
If a turntable is added for rotational alignment of the wafer, then rotational alignment can be achieved, but the device complexity increases considerably
Solution Approach 1:
The patent replaces the mechanical turntable system with a magnetic field-based rotational alignment system. The holder generates a magnetic field that can rotate the wafer frame by interacting with the ferromagnetic particles, eliminating the need for a mechanical turntable and reducing device complexity while maintaining rotational alignment precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a stable and precise centering mechanism that is tolerant of positional deviations, reduces maintenance, and ensures secure handling of wafer frames without impairing further processing steps, enhancing the reliability and efficiency of wafer handling in semiconductor production.
Implementation Method 1
by means of a hydrodynamic vacuum caused by the Bernoulli effect
Implementation Method 2
holder having vacuum nozzles for contacting the wafer frame on the device
Data Source
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AI summary
The invention relates to a device (1), in particular an end effector, for receiving, transporting and/or positioning a wafer frame (2) which is covered with a carrier film (3) for carrying a wafer (4), with a holder (5) which has vacuum nozzles (6) for holding the wafer frame (2) on the device, and with a centering device (28) which has at least one stop (7) which engages in a recess (8) of the wafer frame (2) for centering the wafer frame (2). To achieve precise positioning of the wafer frame, it is proposed that the holder (5) has Bernoulli nozzles (9, 90) for non-contact holding and moving the wafer frame (2) in the direction of the stop (7), and that the stop (7) is adjustable from an initial position (12) to a different centering position (13) in the opposite direction of movement (11) generated by the Bernoulli nozzles (9, 90).