Wafer-to-Frame Tape Bonding with Heated Rollers and Reinforcement Removal
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Solution Overview
Problem
Existing methods for integrating a wafer with an annular frame through a tape, especially when the wafer has a ring-shaped reinforcing part, are inefficient and difficult to automate, leading to low productivity.
Innovation Solution
A processing apparatus is designed with units for automatically integrating a wafer and an annular frame using adhesive or thermocompression bonding tapes, featuring a wafer cassette table, carrying units, frame housing units, pressure bonding units, and reinforcing part removal mechanisms, enabling seamless integration even with protruding reinforcing parts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If adhesive tape is used to integrate the wafer with the annular frame, then the integration process is simple, but adhesive residue may remain on the wafer and lower device quality
Solution Approach 1:
The patent uses a disposable tape that is discarded after use, eliminating the need for complex removal processes and avoiding adhesive residue issues. The tape integrates the wafer with the annular frame during processing and is then removed along with the reinforcing part, ensuring no harmful residue remains on the wafer.
2Manufacturing precision
If thermocompression bonding tape is used to integrate the wafer with the annular frame, then device quality is maintained, but the integration process becomes manual and productivity decreases
Solution Approach 1:
The patent replaces manual thermocompression bonding operations with an automated processing apparatus that uses pressure bonding rollers and heating elements. This automation maintains the quality benefits of thermocompression bonding while dramatically increasing productivity by processing multiple wafers simultaneously without manual intervention.
3Ease of operation
If a ring-shaped reinforcing part is formed on the wafer back surface, then conveyance of the ground wafer is facilitated, but integration with the annular frame becomes difficult and productivity decreases
Solution Approach 1:
The patent performs preliminary actions by forming the ring-shaped reinforcing part on the wafer back surface before integration, which facilitates subsequent conveyance and positioning. The reinforcing part is then removed after integration, having served its purpose during handling and processing stages.
Solution Approach 2:
The patent extracts the ring-shaped reinforcing part from the wafer after it has served its conveyance function. The reinforcing part is removed along with the disposable tape, eliminating the obstacle to high-speed automated processing while maintaining the benefits of enhanced wafer handling during previous stages.
4Manufacturing precision
If manual integration process is used, then device quality is maintained, but productivity is low
Solution Approach 1:
The patent merges multiple functions into a single automated processing apparatus that performs wafer conveyance, positioning, tape application, pressure bonding, heating, and reinforcing part removal in sequence. This integration of multiple operations into one automated system maintains quality control while dramatically increasing productivity compared to manual processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus facilitates efficient and automated integration of wafers with annular frames, enhancing productivity by allowing the use of adhesive or thermocompression bonding tapes, and ensuring proper bonding without manual intervention.
Implementation Method 1
a first pressure bonding roller for executing pressure bonding of a tape to the annular frame
Implementation Method 2
a first heating unit disposed in one of or both the frame table and the first pressure bonding roller
Implementation Method 3
an adhesive tape that has an adhesive layer laid on a sheet
Data Source
AI summary
A processing apparatus includes a wafer table that supports a wafer, a frame table that supports an annular frame, a first tape pressure bonding unit that includes a first pressure bonding roller for executing pressure bonding of a tape to the annular frame, and a second tape pressure bonding unit that includes a second pressure bonding roller for executing pressure bonding of the tape of the tape-attached annular frame to a front surface or a back surface of the wafer. A first heating unit is disposed in one of or both the frame table and the first pressure bonding roller, while a second heating unit is disposed in one of or both the wafer table and the second pressure bonding roller.