Semiconductor Wafer Gap Regions for PCM-Safe Dicing
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Solution Overview
Problem
Silicon carbide-based semiconductor fabrication faces challenges with Process Control Monitoring (PCM) structures, as dicing through these structures causes contamination and damage to devices and cutting instruments, leading to reduced yield and device failure.
Innovation Solution
Incorporation of gap regions between scribe lines on semiconductor wafers to accommodate PCM structures, allowing for their placement without overlap with scribe lines, thereby preventing damage during dicing and increasing device yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If PCM structures are placed within scribe lines, then process control monitoring is enabled, but dicing causes contamination and damage to devices and cutting instruments
Solution Approach 1:
The patent extracts PCM structures from the scribe line region and relocates them to dedicated gap regions between device structures. This separation removes the harmful interaction between dicing operations and PCM structures, eliminating contamination and damage while preserving process control monitoring functionality.
Solution Approach 2:
The patent introduces gap regions as intermediary spaces between device structures and scribe lines. These gap regions serve as dedicated zones that accommodate PCM structures without interfering with dicing operations, thus mediating between the need for process monitoring and the need for clean cutting.
2Object-affected harmful factors
If PCM structures are removed from scribe lines, then dicing damage is prevented, but process control monitoring capability is reduced
Solution Approach 1:
The patent segments the wafer surface into distinct functional regions: device structures, scribe lines, and gap regions. PCM structures are placed in the gap regions, which are specifically designated for monitoring purposes. This segmentation ensures that process control monitoring is maintained in dedicated zones without compromising device structures or interfering with dicing operations.
3Ease of manufacture
If gap regions are introduced between device structures, then PCM structures can be placed without overlap with scribe lines, but wafer area utilization is reduced
Solution Approach 1:
The patent applies local quality by creating gap regions with specific characteristics (sufficient width to accommodate PCM structures) only in locations where they are needed for process control monitoring. The gap regions are strategically positioned between device structures and scribe lines, ensuring that PCM structures can be placed without overlap while minimizing the impact on overall wafer area utilization.
Data Source
AI summary
A semiconductor wafer is provided. The semiconductor wafer includes a substrate. The semiconductor wafer further includes a first device structure on the substrate. The semiconductor wafer further includes a second device structure on the substrate. The semiconductor wafer further includes a gap region on the substrate between the first device structure and the second device structure. The semiconductor wafer further includes one or more process control monitor structures in the gap region. The semiconductor wafer further includes a first scribe line on a first side of the gap region and a second scribe line on a second side of the gap region.