Wafer Container Gas Diffusion Structure for Stable Purging Flow
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Solution Overview
Problem
Conventional gas diffusion devices in wafer containers suffer from inconsistent gas filling performance, poor airflow quality, and fragility at the connection of the porous pipe, along with issues of turbulence and high internal temperatures affecting performance.
Innovation Solution
A gas diffusion device featuring a porous tube with a longitudinal space and a collar to buffer the coupling structure, ensuring a straight-through gas intake path and enhancing airtightness, while being made from thermal-resistant materials to mitigate high-temperature effects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the gas intake module is configured in a non-straight-through manner with offset center axes, then the gas filling can be achieved in limited space, but the flow time increases and purging efficiency deteriorates
Solution Approach 1:
The patent inverts the conventional offset configuration by aligning the center axis of the gas intake module with the center axis of the porous tube, creating a straight-through gas flow path. This inversion resolves the contradiction by maintaining space efficiency while dramatically improving purging efficiency and reducing flow time through the aligned coaxial structure.
2Quantity of substance
If the porous tube size is increased to meet gas diffusion flow demand, then the gas diffusion capability is improved, but the limited space of the wafer container remains unsolved and interference with wafers occurs
Solution Approach 1:
The patent changes the geometric parameters of the porous tube by reducing its radial size while maintaining or enhancing gas diffusion capability through optimized porosity and surface area characteristics. This parameter optimization allows sufficient gas diffusion flow within the limited wafer container space without interfering with wafers.
3Quantity of substance
If a conventional circular porous tube is used for 360-degree air discharge, then the gas distribution is achieved, but turbulence occurs in the interior space
Solution Approach 1:
The patent transitions from a symmetric circular porous tube to an asymmetric structure with a flat surface facing the wafer and a curved surface facing away. This asymmetric configuration directs gas flow in a controlled manner, eliminating turbulence while maintaining effective gas distribution across the wafer surface.
4Ease of manufacture
If the gas intake module and porous tube are assembled with offset configuration, then the winding structure achieves gas filling, but the connection becomes fragile and susceptible to breaking during installation
Solution Approach 1:
The patent inverts the offset configuration to a straight-through coaxial alignment between the gas intake module and porous tube. This inverted design simplifies the connection geometry, making the assembly more robust and less susceptible to breaking during installation while maintaining effective gas filling functionality.
5Ease of operation
If check valves are installed in gas intake modules to control gas flow, then the gas filling control is achieved, but performance degradation or malfunction causes non-uniform airflows and insufficient total flow
Solution Approach 1:
The patent extracts and eliminates the check valve component from the gas intake module, replacing it with a straight-through coaxial porous tube configuration that provides inherent flow control through its porous structure. This extraction removes the reliability issues associated with check valve malfunction while maintaining effective gas flow control and consistency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves improved gas filling consistency, enhanced airflow quality, and increased purging efficiency by eliminating turbulence and reducing the risk of structural damage from high temperatures.
Implementation Method 1
a porous tube (27), having a longitudinal space, the longitudinal space having a closed end and an open end... the buffering gas chamber providing a gas to pass through the porous tube and enter the accommodating space
Data Source
AI summary
The present invention provides a wafer container and a gas diffusion device applied in the wafer container. The wafer container includes a shell, and all components included and applied on the shell are made of thermal resistance materials. The gas diffusion device and the wafer container, when assembled together, utilize a coupling structure and a collar as a protection mechanism for the gas diffusion device. The gas diffusion device has a buffering chamber that provides a buffering tolerance and a communicating space for the gas before the gas enters an interior space of the wafer container.