Wafer Conductive Grid Layout for Electrostatic Charge Dissipation
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Solution Overview
Problem
Semiconductor wafers accumulate electrostatic charge during fabrication and singulation processes, leading to potential damage of devices due to sudden discharge.
Innovation Solution
A conductive grid structure is formed around each device on the wafer, utilizing a semiconducting material like a two-dimensional electron gas layer, to distribute and dissipate electrostatic charge through a ground reference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conductive grid structure is added to the wafer, then electrostatic charge distribution and dissipation is improved, but device complexity and manufacturing complexity increase
Solution Approach 1:
The conductive grid structure is segmented into multiple independent conductive elements arranged in a grid pattern across the wafer surface. Each grid element is electrically isolated from devices in its respective active region but connected to a common ground reference, allowing localized charge dissipation without interfering with device operation. This segmentation enables the ESD protection function to be distributed across the wafer while maintaining simplicity in each local region.
Solution Approach 2:
The conductive grid structure serves as an intermediary element between the insulative substrate and the devices. It provides a dedicated charge dissipation pathway that mediates the electrostatic charge buildup by conducting charges to ground references without directly contacting or interfering with the active device regions. This intermediary approach allows ESD protection while preserving device integrity and simplifying the overall design.
2Object-affected harmful factors
If the substrate is made more insulative to prevent charge accumulation, then charge buildup is reduced, but charge dissipation capability is worsened
Solution Approach 1:
The wafer structure employs different electrical properties in different regions: the substrate and active regions maintain insulative characteristics to prevent charge accumulation, while the conductive grid elements provide localized conductive pathways for charge dissipation. This local quality differentiation allows the substrate to remain insulative for charge prevention while the grid elements provide the necessary conductive paths for safe charge dissipation to ground references.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The conductive grid effectively distributes and dissipates electrostatic charge, minimizing damage to devices during fabrication and singulation processes.
Implementation Method 1
A conductive channel is formed in a saw street region of the wafer. The conductive channel may be used to distribute electrostatic charge across the wafer.
Data Source
AI summary
A wafer includes a substrate that includes a channel layer, a first active region, a second active region, and a saw street region between the first active region and the second active region. The wafer includes a first device formed on the substrate in the first active region. The first device includes a first portion of the channel layer. The wafer includes a second device formed on the substrate in the second active region. The second device includes a second portion of the channel layer. The wafer includes a conductive channel between the first active region and the second active region. The conductive channel is in the saw street of the wafer and includes a third portion of the channel layer.