Wafer Grind Spindle Alignment Adaptation

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Solution Overview

Problem

Traditional wafer grinding methods are inefficient in achieving precise spindle alignment, leading to variations in wafer thickness and shape, especially when grinding non-flat wafers or wafers stacked on carrier wafers, requiring manual and time-consuming adjustments by experienced technicians.

Innovation Solution

A method and system that determine incremental adjustments to spindle alignment using three-dimensional solid model geometry algorithms, combining wafer rotation and indexer motion to measure thickness variations, and implementing predictive and corrective adjustments to achieve optimal wafer shape and thickness profiles, automating the spindle alignment process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If manual alignment adjustments by experienced technicians are used, then spindle alignment can be achieved, but the process is time-consuming and reduces productivity

Engineering Contradiction:

Improvespindle alignment precisionVSAvoidwafer grinding throughput

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The system uses automated measurement and control mechanisms that perform spindle alignment adjustments autonomously based on real-time wafer thickness measurements, eliminating the need for manual intervention by technicians while maintaining high precision alignment

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The patent replaces manual mechanical adjustment operations with an automated control system that uses measurement data from thickness probes to drive precise mechanical adjustments of the spindle alignment through servo mechanisms

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Ease of manufacture

If traditional grinding methods are used, then wafer grinding can be performed, but thickness variations occur due to inability to adapt to non-flat wafer shapes

Engineering Contradiction:

Improvegrinding process simplicityVSAvoidwafer thickness uniformity

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The system dynamically adjusts spindle alignment parameters in real-time based on measured wafer thickness variations, allowing the grinding process to adapt to non-flat wafer shapes and maintain consistent thickness across the wafer surface

Inventive Principle:

Principle #15Dynamics

Solution Approach 2:

The patent implements a closed-loop feedback system where thickness measurements from probes during grinding are continuously fed back to the control system, which then adjusts spindle alignment to compensate for thickness variations and achieve uniform wafer thickness

Inventive Principle:

Principle #23Feedback

3Productivity

If automated measurement systems are implemented, then measurement speed increases, but system complexity increases

Engineering Contradiction:

Improvemeasurement speedVSAvoidmeasurement system complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The measurement system is integrated into the existing grinding apparatus, allowing the same equipment to perform both grinding and measurement functions, thereby increasing measurement speed without proportionally increasing overall system complexity

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS9457446B2Methods and systems for use in grind shape control adaptation

Publication Date: 2016.10.04 REVASUM INC

AI summary

A method of grinding wafers includes determining thickness variations in a wafer; determining incremental adjustments to spindle alignment based on best fit predictions of wafer shaper; and implemented the incremental adjustments to spindle alignment of a grind module.