Wafer Grinding Column with Multi-Point Support
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Solution Overview
Problem
Existing wafer grinding technologies face issues with spindle tilting and vibration, leading to damage and reduced accuracy during coarse and fine grinding processes due to excessive normal force and resonance, resulting in pyramid-shaped marks and cracks.
Innovation Solution
A processing device with a column spanning over both grinding stages, supported by guides that allow vertical movement of grinding stones to prevent tilting and resonance, and constant-pressure feeding mechanisms to manage excessive thrust forces, ensuring the grinding stones operate in a ductility mode to prevent damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a cantilevered grinding stone is used with the support point separated from the processing point, then the device structure is simplified and ease of manufacture is improved, but spindle tilting occurs during grinding causing pyramid-shaped marks and wafer damage
Solution Approach 1:
The patent transitions from a cantilevered single-point support structure to a multi-point support structure where grinding stones are supported at multiple locations along their length. This dimensional change in the support arrangement eliminates spindle tilting by distributing the load and maintaining parallelism between the grinding stone and wafer surface, thereby preventing pyramid-shaped marks while preserving manufacturing ease.
Solution Approach 2:
The grinding stone support system is segmented into multiple support points rather than a single cantilevered support. This segmentation allows each support point to independently bear load, preventing the grinding stone from tilting during operation and eliminating the harmful pyramid-shaped marks on the wafer surface.
2Productivity
If two grinding stones are connected through a grinding stone feeding mechanism, then continuous coarse and fine grinding is enabled improving productivity, but vibration and resonance occur amplifying amplitude and deteriorating processing accuracy
Solution Approach 1:
The patent segments the grinding system into independently supported grinding stones rather than connecting them through a rigid feeding mechanism. This segmentation allows each grinding stone to operate independently with its own support system, preventing vibration resonance between connected stones while maintaining continuous processing capability through sequential operation.
Solution Approach 2:
The patent changes the support arrangement from a connected horizontal arrangement to independently supported vertical arrangements. By providing independent support for each grinding stone at multiple points along their length, the system eliminates the vibration resonance that occurs when stones are mechanically connected, thereby maintaining processing accuracy while preserving productivity.
3Productivity
If large normal force is generated during grinding processing, then grinding efficiency is improved, but the grinding stone inclines raising up causing spindle tilting and wafer damage
Solution Approach 1:
The patent changes from single-point cantilevered support to multi-point support along the grinding stone length. This dimensional change in support arrangement allows large normal forces to be distributed across multiple support points, preventing the grinding stone from inclining or raising up during high-force grinding operations, thereby maintaining reliability while preserving grinding efficiency.
Data Source
AI summary
[Problem] To provide a processing device for grinding by suppressing brittle-mode grinding and stabilizing a wafer. [Solution] A processing device 1 is provided with: an index table 2 on which a wafer W is moved from a coarse grinding stage S2 to a fine grinding stage S3; a column 4 provided so as to span over the coarse grinding stage S2 and the fine grinding stage S3; a coarse grinding means 5 provided on the column 4 above the coarse grinding stage S2, the coarse grinding means 5 performing coarse-grinding processing on the wafer W; and a fine grinding means 6 provided on the column 4 over the fine grinding stage S3, the fine grinding means 6 performing fine-grinding processing on the wafer W.