Wafer Grinding Device Cooling Unit Design
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional wafer grinding devices face issues with wafer deformation due to heat accumulation and grinding byproduct accumulation on the grinding wheel, leading to increased working load, wafer burning, and poor flatness and quality.
Innovation Solution
A wafer grinding device equipped with a cooling unit that extends along the rotation path of the grinding teeth to dissipate heat and a drying unit to remove grinding byproducts, maintaining a constant grinding force and temperature.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If high speed rotation is used to grind the wafer surface, then grinding efficiency is improved, but heat accumulation occurs causing wafer burning and deformation
Solution Approach 1:
A cooling unit is introduced as an intermediary component between the grinding wheel and the wafer. This cooling unit supplies cooling water to the grinding wheel during high-speed rotation, acting as a mediator that removes heat generated by friction while allowing the grinding process to continue at high efficiency
Solution Approach 2:
The cooling unit utilizes hydraulic principles by circulating cooling water through channels in the grinding wheel structure. The water flow carries away heat generated during high-speed grinding, enabling sustained high productivity without thermal damage to the wafer
2Productivity
If continuous grinding is performed without interruption, then productivity is improved, but grinding byproducts accumulate on the grinding teeth causing force deterioration
Solution Approach 1:
The cooling unit enables continuous grinding operation by continuously removing heat and flushing away grinding byproducts. The cooling water flow maintains constant grinding force by preventing byproduct accumulation on the grinding teeth, allowing uninterrupted productive operation
Solution Approach 2:
The cooling water serves dual functions: it cools the grinding wheel and simultaneously flushes away grinding byproducts from the grinding teeth. This self-cleaning action maintains grinding force without requiring separate interruption for cleaning, enabling continuous productive operation
3Temperature
If cooling water is supplied to the grinding wheel, then heat removal is improved, but water may contaminate the wafer surface
Solution Approach 1:
The cooling water is supplied locally to the grinding wheel structure rather than directly to the wafer surface. The cooling channels are positioned within the grinding wheel body, allowing heat removal at the source while preventing water contamination of the wafer surface through precise local application
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively suppresses wafer deformation and improves grinding quality by maintaining a consistent grinding force and temperature, resulting in enhanced wafer flatness and reduced TTV values below 1 μm.
Implementation Method 1
A wafer grinding device equipped with a cooling unit that extends along the rotation path of the grinding teeth to dissipate heat
Implementation Method 2
a drying unit to remove grinding byproducts, maintaining a constant grinding force and temperature
Data Source
AI summary
The present disclosure provides a wafer grinding device comprising: a chuck table to suction the wafer thereon, a grinding wheel to grind the wafer by a predetermined thickness, wherein the grinding wheel includes a grinding body, and grinding teeth arranged along and on a bottom outer periphery of the grinding body, wherein the grinding teeth are segmented; and a cooling unit at least partially extending along a region between a departure point of the grinding teeth from the wafer during rotation of the teeth, and a re-encounter point of the teeth with the wafer during rotation of the teeth, wherein the region extends along rotation path of the grinding teeth.