Wafer Backside Grinding With Light-Removable Resin Support

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Solution Overview

Problem

Existing methods for backside grinding of semiconductor wafers lack effective protection and efficient removal of the base material layer during the manufacturing process.

Innovation Solution

A method involving the use of a laminated body structure with a resin layer containing a light-reduced molecular weight resin, which is irradiated to remove the base material layer, allowing for efficient backside grinding and protection of the semiconductor wafer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a back grinding tape is bonded to the semiconductor wafer for protection during backside grinding, then the semiconductor wafer is protected, but the base material layer removal becomes difficult and time-consuming

Engineering Contradiction:

Improvesemiconductor wafer protectionVSAvoidbase material layer removal time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

The patent applies preliminary action by forming a resin layer containing photodecomposable groups on the semiconductor wafer before backside grinding. This resin layer is specifically designed to be removed by light irradiation after grinding, eliminating the time-consuming manual removal process of traditional back grinding tapes while maintaining wafer protection during the grinding operation.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent utilizes parameter changes by employing a resin whose molecular structure changes upon light irradiation. The resin contains photodecomposable groups that break down when exposed to light, transforming the resin from a protective solid layer into removable fragments. This chemical parameter change enables automatic removal of the base material layer without manual intervention, resolving the contradiction between protection and easy removal.

Inventive Principle:

Principle #35Parameter changes

2Reliability

If a traditional back grinding tape is used, then the semiconductor wafer is protected during grinding, but the process complexity increases due to multiple steps for tape application and removal

Engineering Contradiction:

Improvesemiconductor wafer protectionVSAvoidmanufacturing process steps

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent merges the protective function and the removable feature into a single integrated resin layer. Instead of using a separate back grinding tape that requires application and removal steps, the resin layer is formed directly on the semiconductor wafer and automatically removed through light irradiation. This merging of functions reduces the number of manufacturing steps and simplifies the overall process while maintaining reliable wafer protection during grinding.

Inventive Principle:

Principle #5Merging (Combining)

3Productivity

If light irradiation is used to remove the base material layer, then the removal process becomes efficient and simple, but the resin layer must be specially designed with photodecomposable groups

Engineering Contradiction:

Improvebase material layer removal efficiencyVSAvoidresin layer composition

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The patent replaces the mechanical removal process (manual peeling or cutting of back grinding tapes) with a photochemical process. By incorporating photodecomposable groups into the resin layer, the removal mechanism shifts from mechanical action to light-induced chemical decomposition. This substitution dramatically improves removal efficiency and eliminates manual intervention, while the resin composition complexity is offset by the automation and precision of the photochemical removal process.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method provides sufficient protection for the semiconductor wafer during grinding and facilitates easy removal of the base material layer, enhancing the manufacturing process efficiency.

Implementation Method 1

a resin layer containing a resin in which the molecular weight is reduced by irradiation with light

Methodology Applied

Scientific EffectPhotodecomposition: Photodissociation

Data Source

PatentUS20250299997A1Method for manufacturing semiconductor device

Publication Date: 2025.09.25 RESONAC CORP

AI summary

A method for manufacturing a semiconductor device is disclosed. The method for manufacturing a semiconductor device includes a first laminated body manufacturing step of manufacturing a first laminated body including, in this order, a semiconductor wafer, a resin layer containing a resin in which the molecular weight is reduced by irradiation with light, and a base material layer; a second laminated body manufacturing step of manufacturing a second laminated body by performing backside grinding on the semiconductor wafer of the first laminated body; and a third laminated body manufacturing step of manufacturing a third laminated body including a semiconductor wafer subjected to backside grinding and the resin layer by removing the base material layer of the second laminated body.