Semiconductor Wafer Gripper Groove for Liquid Diversion
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing grippers for transporting semiconductor wafers after chemical-mechanical polishing (CMP) fail to adequately protect the wafers from recontamination by liquid cleaning agents, which can lead to surface roughness and contamination.
Innovation Solution
A gripper design featuring a flat body with curved arms and a groove that directs liquid away from the wafer surface, incorporating retaining pins for clamping, and a polymer construction to minimize weight and flow resistance, ensuring liquids drip off without reaching the wafer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a conventional gripper without a groove is used to transport the semiconductor wafer, then the gripper structure is simple, but the liquid cleaning agent directly contacts the wafer surface causing recontamination and surface roughness
Solution Approach 1:
The gripper body is segmented into distinct functional zones: a groove channel section for liquid diversion, a support surface section for wafer contact, and retaining pin sections for clamping. This segmentation allows the liquid diversion function to be added without compromising the existing gripping function, effectively preventing recontamination while maintaining structural clarity
Solution Approach 2:
The groove channel acts as an intermediary structure between the liquid cleaning agent and the semiconductor wafer surface. It intercepts and redirects the liquid flow path, preventing direct contact between the harmful liquid and the wafer surface, thus eliminating recontamination without requiring complex protective coverings
2Object-affected harmful factors
If the groove is extended to the ends of the arms, then liquid diversion is maximized, but the structural integrity and clamping force are reduced
Solution Approach 1:
The groove channel is strategically positioned with localized depth and width variations along its length. The groove is deeper and wider at sections where liquid flow is highest, and shallower where clamping force is critical. This local quality variation optimizes liquid diversion efficiency while preserving the structural strength needed for reliable clamping connection
Solution Approach 2:
The groove extends partially along the arms rather than to the very ends, providing sufficient liquid diversion capability without过度 compromising the structural integrity. This partial action approach achieves the necessary protection against liquid contact while maintaining adequate clamping force for wafer transport
3Ease of manufacture
If the arms are made with constant distance between them, then manufacturing is simpler, but liquid flow guidance is less effective
Solution Approach 1:
The arms are designed with curved inner sides rather than straight edges, and the groove channel follows this curvature. This curved geometry naturally guides liquid flow along the arm contours more effectively, directing liquid away from the wafer surface. The curvature is optimized to balance liquid diversion efficiency with manufacturability, avoiding excessively complex shapes while achieving superior liquid flow management
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Significantly reduces recontamination risks by effectively guiding liquids past the wafer, minimizing surface contact and residue, thus maintaining the cleanliness of the semiconductor wafer.
Implementation Method 1
The groove follows an inner side of the arms, which groove is incorporated into the arms and terminates at edges, the edges being spread apart from the ends of the arms. The proposed channel directs liquid largely past the semiconductor wafer to the edges of the channel, from which it can drip off without first reaching the surface of the semiconductor wafer.
Data Source
Figure 1
Figure 2
Figure 3
AI summary
Gripper for transporting a vertically arranged semiconductor disk, comprising a flat body with a head section and a foot section forming a flat front surface; arms extending from the head section to spaced-apart ends in the foot section; a support surface recessed from the plane of the front surface at the end sections of the arms; and retaining pins arranged on the end sections for creating a clamping connection between the semiconductor disk and the body, characterized by a groove following an inside surface of the arms, which is machined into the arms and terminates at edges, the edges being spread away from the ends of the arms.