Wafer Gripper Pin Detection for Transparent Wafer Presence
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing wafer processing apparatuses fail to effectively detect the presence of wafers, particularly transparent wafers, and may continue processing broken or lost wafers due to limitations in light path interruption detection, leading to inefficiencies and waste.
Innovation Solution
The apparatus employs a detector that indirectly determines the presence of a wafer by detecting the configuration of gripping pin assemblies, which are rotatable between gripping and non-gripping positions, allowing for accurate detection of wafer presence and breakage through the rotational positions of these pin assemblies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a light path interruption detector is used to detect wafer presence, then the detection method is simple, but transparent wafers cannot be detected and broken wafers may not be properly identified
Solution Approach 1:
The patent introduces an intermediary mechanism (gripper rotation detector) that indirectly detects wafer presence through the rotational state of the gripper, rather than directly detecting the wafer itself. This mediator allows the system to detect both transparent and broken wafers by monitoring whether the gripper rotates to its normal position, solving the limitation of light path interruption methods.
2Ease of manufacture
If light path interruption detection is used, then the detection mechanism is straightforward, but it fails to detect transparent wafers and may continue processing broken wafers
Solution Approach 1:
The patent replaces the optical detection system (light path interruption) with a mechanical detection system that monitors the rotational position of the gripper. This mechanical substitution provides more reliable detection of transparent and broken wafers by detecting whether the gripper can rotate to its normal position, eliminating the failures of the optical method while maintaining manufacturing simplicity.
3Strength
If the pin assemblies are designed to grip the wafer periphery, then wafer holding is secure, but detection of wafer presence becomes more complex
Solution Approach 1:
The patent makes the gripper assembly self-reporting by detecting its own rotational position. The gripper's rotation state automatically indicates wafer presence without requiring additional detection components. This self-service approach maintains strong gripping capability while simplifying the detection system, as the gripper's mechanical state directly provides the detection information.
Data Source
AI summary
Apparatus for processing a wafer-shaped article, the apparatus comprising a support configured to support the wafer-shaped article during a processing operation to be performed on the wafer-shaped article; wherein: the support comprises a support body and a plurality of gripping pin assemblies adapted and positioned relative to the support body for gripping the wafer-shaped article, wherein the gripping pin assemblies are rotatable between a gripping configuration in which the gripping pin assemblies are arranged to grip the wafer-shaped article, and a non-gripping configuration in which the gripping pin assemblies are not arranged to grip the wafer-shaped article; and the apparatus comprises a detector configured to directly or indirectly detect a configuration of the gripping pin assemblies.