Wafer Handling Apparatus with Compact Rack and Dual-Arm Transfer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing substrate carrying and processing apparatuses are limited by height constraints, leading to reduced storage capacity and increased waiting times due to the need for multiple stages and complex substrate handling schedules, especially when varying processing conditions are required for different types of resist films.
Innovation Solution
A substrate carrying and processing apparatus with a carrier block, processing block, and substrate storing section that allows vertical and horizontal movement, featuring a compact design with narrower shelf spacing to accommodate more substrates, and includes antireflection film forming units and cooling plates to manage different processing conditions efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple stages and complex substrate handling schedules are used to accommodate varying processing conditions, then processing flexibility is improved, but device complexity and waiting time increase
Solution Approach 1:
The substrate storing section is segmented into multiple individual placing portions (first placing portion, second placing portion, etc.), each capable of independently holding substrates. This segmentation allows the system to store and retrieve substrates from different locations based on processing needs, providing flexibility without requiring complex overall system redesign.
Solution Approach 2:
The substrate carrying apparatus is designed with universal carrying sections that can transport substrates to any placing portion within the storing section. This multi-functional capability allows a single carrying apparatus to serve multiple processing conditions and substrate types, reducing the need for specialized handling schedules for each scenario.
2Adaptability or versatility
If multiple stages and complex substrate handling schedules are used to accommodate varying processing conditions, then processing flexibility is improved, but loss of time increases
Solution Approach 1:
Substrates are pre-positioned in different placing portions according to their required processing conditions before the actual processing sequence begins. This preliminary arrangement allows the carrying apparatus to efficiently retrieve substrates in the optimal sequence, eliminating waiting time caused by sequential retrieval from a single location.
Solution Approach 2:
The substrate storing section utilizes a two-dimensional arrangement with multiple placing portions positioned at different locations (front, rear, left, right sides). This spatial dimensionality allows parallel access to multiple substrates simultaneously, reducing the time required to handle substrates with different processing requirements compared to a single-line sequential system.
3Quantity of substance
If substrate carrying apparatus is designed for vertical and horizontal movement with narrow shelf spacing, then storage capacity is improved, but manufacturing precision requirements increase
Solution Approach 1:
The substrate carrying apparatus incorporates movable components that can dynamically adjust positions and orientations during substrate transport. This dynamic capability compensates for minor manufacturing tolerances in shelf spacing, allowing the system to maintain operational precision even with compact dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves downsizing, increased storage capacity, and enhanced throughput by allowing flexible substrate handling and processing, stabilizing substrate support and conveyance, and enabling efficient handling of various resist film types with reduced complexity.
Implementation Method 1
a cooling unit adapted to cool a substrate after being subjected to the heating process to a predetermined temperature
Implementation Method 2
a heating unit adapted to heat a substrate after being subjected to the resist coating and processing step and/or to heat a substrate after being subjected to the exposing step
Data Source
AI summary
The present invention provides a substrate carrying and processing apparatus which is intended to reduce the size of the space for storing substrates in each substrate storing section as much as possible so as to downsize the apparatus and increase the number of substrates to be stored therein as well as to enhance the throughput. The substrate carrying and processing apparatus comprises a carrier block S1 which is adapted to position carriers 20 each receiving wafers W therein, a processing block S2 including processing units U1 to U4, 31 used for processing each wafer, a main arms A1 adapted to transfer each wafer to each processing unit, a rack unit U5 which is disposed between the carrier block and the processing block and able to store wafers to be processed, and a transfer arm D adapted to transfer each wafer to the rack unit. The rack unit has openings 11, 12 to which the main arm and the transfer arm can transfer each substrate along two directions crossing to each other, and includes a plurality of placing shelves with a space therebetween and adapted to support a wafer. The main arms and transfer arms are configured such that they can be advanced into and retracted from the substrate storing section and such that they can be overlapped to the corresponding placing shelf in the vertical direction, when viewed in the horizontal direction.