Wafer Support Heater Control for Faster Temperature Stabilization

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Solution Overview

Problem

The temperature of the wafer support in semiconductor processing apparatuses takes a significant amount of time to stabilize, and fluctuations in temperature due to disturbances can degrade process results and yield.

Innovation Solution

Implementing iterative learning-based feedforward and feedback controls to determine heater power for stabilizing and maintaining the temperature of the wafer support within a target range during semiconductor processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If conventional temperature control methods are used, then the wafer support temperature can be controlled, but the temperature takes considerable time to stabilize and fluctuates due to disturbances

Engineering Contradiction:
Improvewafer support temperatureVSAvoidtemperature stabilization time
Core Design Contradiction:
TemperatureVSLoss of time

Solution Approach 1:

The feedforward controller receives the temperature setting signal and generates a feedforward control signal in advance, before the temperature stabilization process begins. This preliminary action anticipates the required heater power adjustments needed to reach and maintain the target temperature, reducing the time required for temperature stabilization compared to conventional reactive control methods.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The feedback controller continuously receives the actual temperature measurement signal and generates a feedback control signal to correct temperature deviations. This closed-loop feedback mechanism ensures that temperature fluctuations due to disturbances are promptly detected and corrected, maintaining stable temperature control while reducing stabilization time.

Inventive Principle:
Principle #23Feedback

2Reliability

If conventional temperature control methods are used, then basic temperature regulation is achieved, but temperature fluctuations due to disturbances degrade process results and yield

Engineering Contradiction:
Improveprocess results consistencyVSAvoidtemperature stability
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The feedback controller continuously monitors the actual temperature through the measurement signal and generates corrective control actions to eliminate temperature deviations caused by disturbances. This ensures high temperature stability and consistent process results throughout the semiconductor manufacturing process.

Inventive Principle:
Principle #23Feedback

Solution Approach 2:

The iterative learning controller acts as an intermediary between the feedforward and feedback controllers, processing the temperature setting signal and measurement signal to optimize the control signal. This intermediary component enhances the overall control system's ability to maintain temperature stability and improve process reliability by learning from past performance and adapting to disturbance patterns.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Device complexity

If simple control methods are used, then the control system is simple, but the temperature cannot be quickly stabilized and maintained within target range

Engineering Contradiction:
Improvecontrol system complexityVSAvoidtemperature stabilization speed
Core Design Contradiction:
Device complexityVSSpeed

Solution Approach 1:

The feedforward controller performs preliminary temperature control actions based on the setting signal before disturbances occur, enabling faster temperature stabilization. This proactive approach reduces the time required to reach target temperature compared to simple reactive control systems.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The feedback controller provides continuous temperature monitoring and correction, ensuring the temperature is quickly stabilized and maintained within the target range. The combination of feedforward and feedback control creates a more responsive system than simple control methods while maintaining reasonable complexity.

Inventive Principle:
Principle #23Feedback

4Manufacturing precision

If iterative learning-based feedforward and feedback controls are implemented, then temperature stabilization speed and accuracy improve, but the control system complexity increases

Engineering Contradiction:
Improvetemperature control precisionVSAvoidcontrol system complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The feedforward controller uses the temperature setting signal to generate advance control actions, improving temperature control precision by anticipating required adjustments before disturbances occur. This preliminary action reduces temperature deviations and improves manufacturing precision.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The feedback controller continuously corrects temperature deviations using the measurement signal, ensuring high temperature control precision. The iterative learning controller processes both feedforward and feedback signals to optimize control accuracy, achieving superior temperature control precision despite increased system complexity.

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Stable temperature control improves process results and enhances yield by maintaining consistent performance across semiconductor processing apparatuses.

Implementation Method 1

a heater power supply configured to supply heater power to the heater to control a temperature of the wafer support

Methodology Applied
Scientific EffectJoule heating: Joule Heating

Data Source

PatentUS20250329561A1Semiconductor processing apparatus
Publication Date: 2025.10.23 SAMSUNG ELECTRONICS CO LTD
  • US20250329561A1 patent drawing
  • US20250329561A1 patent drawing
  • US20250329561A1 patent drawing

AI summary

A semiconductor processing apparatus may include a wafer support including a heater; a heater power supply configured to supply heater power to the heater; and a processor configured to receive a setting signal indicating a set temperature of the wafer support, determine the heater power using the setting signal, receive a measurement signal obtained by measuring the temperature of the wafer support, generate an error signal based on the setting signal and the measurement signal, generate a feedforward signal based on the setting signal, generate an iterative learning signal based on the error signal, generate a feedback signal based on the error signal, determine a control signal based on the feedforward, iterative learning, and feedback signals, output the control signal to the heater power supply, and determine the heater power in a sampling period of the measurement signal being within a target range as a final heater power.