Wafer Test Heating Structure With Insulating Thermal Blocks
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Solution Overview
Problem
Existing wafer test technologies face issues with high voltage power generation due to direct contact between the heat sink and the heating component, leading to leakage and safety hazards, as well as uneven heating of the wafer.
Innovation Solution
A heating structure for a wafer test device is introduced, featuring a heating base with a heating element, a mounting component with evenly arranged mounting stations, and a plurality of insulating thermo-conductive blocks that protrude to contact the clamp, preventing direct contact and ensuring even heat distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Use of energy by moving object
If the heat sink directly contacts the heating component, then heat transfer efficiency is improved, but high voltage leakage and safety hazards occur
Solution Approach 1:
The patent introduces an insulating structure as an intermediary component between the heating component and the heat sink. This insulating structure includes an insulating base and insulating columns that physically separate the conductive parts while allowing thermal energy to pass through, thus preventing electrical leakage while maintaining heat transfer efficiency.
2Use of energy by moving object
If the heat sink directly contacts the heating component, then heating efficiency is improved, but uneven heating of the wafer occurs
Solution Approach 1:
The patent divides the heating structure into multiple segments: the heating component, the insulating base, multiple insulating columns positioned at different locations, and the heat sink. This segmentation allows for more precise control of heat distribution pathways, enabling uniform heating across the wafer surface while maintaining overall heating efficiency.
3Reliability
If an insulating structure is introduced between the heat sink and heating component, then electrical safety is improved, but heat transfer efficiency decreases
Solution Approach 1:
The insulating structure is designed with localized insulation features - the insulating base and insulating columns are positioned specifically at critical electrical separation points while leaving thermal pathways open. This local quality approach ensures electrical isolation where needed while preserving heat transfer capabilities in other areas, thus maintaining overall heat transfer efficiency while ensuring safety.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents high voltage power generation and ensures even heating of the wafer, improving the accuracy and safety of wafer tests while maintaining efficient heat transfer.
Implementation Method 1
a heating base (10), provided with a heating element (11) inside the heating base
Implementation Method 2
a plurality of insulating thermo-conductive blocks (30). Each of the plurality of insulating thermo-conductive blocks (30) is disposed at one corresponding mounting station (21) of the plurality of mounting stations and protrudes from the mounting component (20) for contacting a clamp (200)
Data Source
AI summary
A heating structure and a wafer test device are provided. The heating structure includes: a heating base, provided with a heating element inside the heating base; a mounting component, disposed above the heat base and including a plurality of mounting stations arranged at intervals; and a plurality of insulating thermo-conductive blocks. Each of the plurality of insulating thermo-conductive blocks is disposed at one corresponding mounting station of the plurality of mounting stations and protrudes from the mounting component for contacting a clamp of the wafer test device.