Wafer Heating Lamp Configuration for Uniform Temperature Distribution
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Solution Overview
Problem
In semiconductor device manufacturing, preheating wafers before ion implantation often results in uneven temperature distribution, leading to warpage and increased processing time due to inadequate heating techniques.
Innovation Solution
A wafer heating apparatus with a heating chamber and a configuration of multiple circular band-shaped lamps with open regions, where each lamp is positioned to overlap and provide uniform heating, including auxiliary lamps to fill gaps in heat transfer, ensuring consistent temperature across the wafer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a single heater is used to heat the wafer, then the heating operation can be performed, but the temperature distribution becomes uneven causing warpage
Solution Approach 1:
The heating system is divided into multiple independent heating lamps arranged in specific patterns. Each lamp contributes to heating a specific region of the wafer, and their combined effect achieves uniform temperature distribution across the entire wafer surface, eliminating warpage caused by single-point heating.
Solution Approach 2:
Different regions of the wafer receive heating from lamps positioned at specific locations. The lamp arrangement is designed so that each region receives appropriate heating intensity, with lamps positioned to compensate for variations in heat transfer across different areas of the wafer surface.
2Productivity
If preheating is performed to increase wafer throughput, then processing efficiency improves, but uneven heating causes warpage and requires additional processing time
Solution Approach 1:
The wafer is preheated using the multi-lamp heating system before entering the main chamber. The preliminary heating action is designed to achieve uniform temperature distribution efficiently, so that when the wafer enters the main chamber, it requires minimal additional heating time, thereby increasing overall throughput without compromising heating quality.
3Temperature
If multiple lamps are arranged in circular band shapes with open regions, then uniform heating is achieved, but the device complexity increases
Solution Approach 1:
The heating system uses multiple circular band-shaped lamps with open regions rather than a single complex heating element. Each lamp is a simple modular component, and their arrangement in specific patterns creates the desired uniform heating effect. This segmentation simplifies the overall device design compared to a single complex heater.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves a uniform temperature distribution of 50° C. or less with an average temperature increase of 76.8° C., reducing warpage and enhancing wafer throughput by ensuring consistent heat transfer across the wafer surface.
Implementation Method 1
a heating lamp disposed in the internal space of the heating chamber and configured to heat a wafer
Implementation Method 2
a heating lamp disposed in the internal space of the heating chamber and configured to heat a wafer
Data Source
AI summary
A wafer heating apparatus may include a heating chamber having an internal space and a heating lamp disposed in the internal space of the heating chamber. The heating lamp may be configured to heat a wafer. The heating lamp may include a plurality of lamps. Each of the plurality of lamps may have circular band shapes with open regions. At least one lamp may be disposed in at least one region among regions adjacent to the open regions of the plurality of lamps.