Wafer Heating Module Preheats Wafers to Reduce Temperature Hunting
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Solution Overview
Problem
In semiconductor manufacturing, the temperature difference between a room-temperature wafer and a hot wafer chuck during the wafer testing process leads to temperature hunting, delaying stabilization and reducing productivity.
Innovation Solution
An apparatus with a wafer handling arm equipped with a wafer heating module preheats the wafer before loading it onto a wafer chuck, maintaining the wafer at a temperature lower than the chuck, thus reducing temperature hunting and stabilizing the wafer quickly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the wafer is transferred at room temperature to a hot wafer chuck, then the wafer testing process can be performed, but temperature hunting occurs and temperature stabilization time is extended
Solution Approach 1:
The patent applies preliminary action by preheating the wafer on the wafer handling arm before it is transferred to the wafer chuck. The wafer heating module heats the wafer in advance during the transfer phase, so that when the wafer contacts the hot chuck, the temperature difference is minimized, preventing temperature hunting and reducing stabilization time.
2Loss of time
If a wafer heating module is added to the wafer handling arm, then temperature stabilization time is reduced, but device complexity increases
Solution Approach 1:
The patent merges the wafer heating function with the wafer handling arm by integrating the wafer heating module directly onto the arm structure. The heating module is positioned on the arm plate to face the wafer support surface, combining two functions (handling and heating) into a single integrated unit, thereby minimizing additional complexity while achieving temperature preheating.
3Use of energy by moving object
If the wafer heating module is positioned close to the wafer support surface, then heating efficiency is improved, but the risk of direct contact and potential damage increases
Solution Approach 1:
The patent applies local quality by creating a localized heating zone with precise spatial positioning. The wafer heating module is positioned at a specific distance from the wafer support surface to provide effective heating while maintaining a safety gap. The heating is concentrated in the local region where the wafer is held, ensuring sufficient thermal transfer without risking direct contact between the heating module and the wafer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The preheating of the wafer before loading onto the wafer chuck significantly reduces temperature stabilization time, improving productivity by minimizing temperature hunting and enhancing the efficiency of the wafer testing process.
Implementation Method 1
a wafer heating module coupled to the wafer handling arm and arranged parallel to the wafer. The wafer heating module preheats the wafer to be loaded on the wafer chuck
Data Source
AI summary
An apparatus for testing a wafer includes a wafer chuck on which the wafer is loaded to perform a wafer test process. The wafer chuck is maintained at a high temperature in a predetermined temperature range. The apparatus for testing a wafer further includes a wafer handling arm supporting the wafer and transferring the wafer to the wafer chuck, and a wafer heating module coupled to the wafer handling arm, arranged parallel to the wafer, and preheating the wafer to be loaded on the wafer chuck.