Wafer Heating Plate Calibration for Uniform Thermal Processing
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Solution Overview
Problem
In semiconductor manufacturing, achieving uniform thermal processing of substrates is challenging due to temperature deviations caused by gaps between the substrate and heating plate, internal structures, and air flow, which complicates the uniform application of thermal energy.
Innovation Solution
A substrate processing method that uses a sensor substrate with multiple temperature sensors to determine the output of a heater by measuring temperature distributions and adjusting the heating plate's temperature distribution based on a transfer coefficient, ensuring uniform thermal processing by minimizing temperature deviations across the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a predetermined gap exists between the substrate and heating plate, then thermal energy can be applied to the substrate, but the temperature distribution becomes non-uniform due to heat transmission loss
Solution Approach 1:
The heating plate is divided into multiple heating regions with independent temperature control. Each heating region can be adjusted separately to compensate for temperature variations caused by the gap between the substrate and heating plate, achieving uniform overall temperature distribution despite energy transmission losses.
Solution Approach 2:
Different regions of the heating plate are assigned different target temperatures based on their specific thermal characteristics and distance from the substrate. This local quality adjustment ensures that each region compensates for its own heat transmission losses, resulting in uniform substrate temperature across the entire surface.
2Temperature
If the temperature of the heating plate is preset to compensate for heat loss, then uniform thermal processing can be achieved, but the complexity of temperature control increases
Solution Approach 1:
Temperature sensors are placed in each heating region to detect actual substrate temperature. The controller uses this feedback information to automatically adjust the heater output in each region, maintaining uniform temperature distribution without requiring complex manual presetting of temperature compensation values.
Solution Approach 2:
The system automatically determines the output of each heater based on temperature sensor readings and pre-stored transfer coefficients. The controller self-adjusts the heating plate temperature distribution without external intervention, simplifying operation while maintaining thermal uniformity.
3Measurement precision
If multiple temperature sensors are used to measure temperature distribution, then accurate temperature control can be achieved, but the cost and complexity of the system increase
Solution Approach 1:
The temperature sensors serve multiple functions: they measure the substrate temperature in their respective regions, provide feedback for controller adjustment, and enable determination of heater output through pre-stored transfer coefficients. This multi-functionality reduces the need for separate measurement and control systems, offsetting the complexity increase from using multiple sensors.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method allows for precise and uniform thermal processing of substrates by accurately adjusting the heating plate's temperature distribution, ensuring consistent temperature across the substrate, thereby improving the semiconductor manufacturing process.
Implementation Method 1
heating the sensor substrate through an initial output of the heater
Implementation Method 2
measuring temperature distribution of the sensor substrate
Data Source
AI summary
Disclosure provides a substrate processing method, a thermal processing apparatus, and semiconductor manufacturing equipment that allow wafer thermal processing to be uniformly performed at a preset temperature. The substrate processing method includes determining an output of a heater provided in a heating plate by using a sensor substrate including a plurality of substrate temperature sensors, and performing thermal processing with respect to a substrate in response to the output of the heater. The determining of the output of the heater includes heating the sensor substrate through an initial output of the heater, measuring temperature distribution of the sensor substrate, determining the amount of change of target temperature distribution of the heating plate, and adjusting the output of the heater in response to the amount of change of the target distribution of the temperature heating plate.