Wafer Roller Holder With Eccentric Motion for Faster Cleaning
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Solution Overview
Problem
Highly integrated devices such as memory circuits, logic circuits, and image sensors face issues with foreign matter like fine particles and dust adhering to their surfaces, leading to short-circuits, circuit defects, patterning deviations, and focal distance deviations, which necessitate efficient cleaning of both the front and back surfaces of wafers during processing.
Innovation Solution
A substrate holding apparatus that rotates wafers using rollers and eccentric shafts, allowing for a combination of rotational and circular motion, thereby increasing processing speed by enhancing the relative speed between processing tools and the substrate surface, while also incorporating counterweights to stabilize and prevent vibration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a substrate is rotated using conventional chucks, then the substrate can be held and processed, but the processing efficiency is low due to limited relative speed between processing tools and substrate surface
Solution Approach 1:
The substrate holding apparatus transitions from static chuck rotation to dynamic combined motion. The substrate performs both rotation about its own axis and circular motion of its center, creating dynamic movement patterns that significantly increase the relative speed between the processing tool and substrate surface, thereby improving processing efficiency
Solution Approach 2:
The invention adds a new dimension of motion by making the substrate center move in a circular path while the substrate rotates. This combines one-dimensional rotation with two-dimensional circular translation, creating enhanced relative motion that increases processing speed and efficiency
2Productivity
If rollers are rotated at high speed to increase processing efficiency, then productivity improves, but vibration occurs that affects processing precision
Solution Approach 1:
Counterweights are attached to the rollers to balance the centrifugal forces generated during high-speed rotation. This counterbalancing mechanism reduces vibration and maintains processing precision while allowing the rollers to rotate at high speeds for improved productivity
Solution Approach 2:
The system utilizes controlled vibration through counterweights to cancel out harmful vibrations. By generating counteracting vibrational forces, the system maintains stability during high-speed operation, ensuring both high processing rates and precision
3Productivity
If multiple rollers are used to hold and rotate the substrate, then processing efficiency increases, but the device complexity increases
Solution Approach 1:
Multiple rollers are merged into a coordinated system where they collectively perform both substrate holding and dual-mode rotation. The rollers work in unison to create combined rotational and circular motion, achieving enhanced productivity while managing structural complexity through functional integration
4Speed
If the substrate is made to perform circular motion in addition to rotation, then the relative speed with processing tool increases, but the device complexity increases
Solution Approach 1:
The roller mechanism is designed to perform multiple functions simultaneously: holding the substrate, enabling rotation about the substrate axis, and creating circular motion of the substrate center. This multi-functionality achieves high relative speed for processing while minimizing additional device complexity through integrated design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively increases processing efficiency by ensuring uniform and synchronized rotation and circular motion of the wafer, leading to improved cleaning and processing rates, reducing the risk of defects and deviations.
Implementation Method 1
eccentric shafts coupling the rollers and the roller rotating mechanism, the eccentric shafts having first shaft portions and second shaft portions, the second shaft portions being eccentric relative to the first shaft portions
Implementation Method 2
counter weights secured to the eccentric shafts, respectively, each of the counter weights and corresponding one of the rollers being arranged symmetrically with respect to corresponding one of the first shaft portions
Data Source
AI summary
A substrate holding apparatus which can enhance the efficiency of processing of a substrate, such as a wafer, is disclosed. The substrate holding apparatus for holding a substrate and rotating the substrate, includes: rollers capable of contacting a periphery of the substrate; a roller rotating mechanism configured to rotate the rollers; and eccentric shafts coupling the rollers and the roller rotating mechanism, the eccentric shafts having first shaft portions and second shaft portions, the second shaft portions being eccentric relative to the first shaft portions, the first shaft portions being secured to the roller rotating mechanism, and the rollers being secured to the second shaft portions, respectively.