Wafer Transfer Holder With Pivoted Lift to Prevent Flip Damage
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Solution Overview
Problem
The processing of semiconductor wafers involves multiple tools and unavoidable defects during wafer transfer between these tools.
Innovation Solution
A work piece holder with a support baffle and a pivoted elevating element that moves between an unlock and a lock status, allowing the holder to flip without striking the wafer and preventing contamination from falling on the wafer's front surface.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the wafer is transferred between multiple processing tools, then the manufacturing process can be completed, but defects are inevitably caused during transfer
Solution Approach 1:
The holder is divided into distinct functional segments: a support baffle structure and a separate elevating element. This segmentation allows the elevating element to be independently pivoted between unlock and lock statuses, enabling the wafer to be securely held during transfer while maintaining the ability to elevate and protect the wafer front surface from contamination
Solution Approach 2:
The elevating element is positioned and configured in advance to elevate the wafer before the transfer process begins. By preliminarily elevating the wafer and positioning it against the support baffle, the system prepares the wafer in a protected state before exposure to potential contamination during transfer, thus reducing defects before they can occur
2Ease of operation
If the holder flips during transfer, then the wafer can be repositioned, but the wafer may be struck and damaged
Solution Approach 1:
The elevating element elevates the wafer in advance before the holder is flipped. This preliminary elevation ensures that when the holder flips, the wafer is already positioned at a safe height and supported, preventing it from being struck by the holder structure during the flipping motion
Solution Approach 2:
The support baffle is positioned to provide cushioning support for the wafer before the flip occurs. By having the support structure in place beforehand, the system ensures that if any contact occurs during flipping, the wafer is cushioned and protected from damage
3Device complexity
If the wafer front surface is exposed during transfer, then the transfer process is simpler, but contamination can fall on the wafer
Solution Approach 1:
The elevating element is designed to be dynamically movable between unlock and lock statuses. During transfer, it pivots to the lock status to elevate the wafer and protect the front surface. This dynamic adjustment allows the system to adapt to different transfer phases, maintaining simplicity while providing protection when needed
Solution Approach 2:
The holder structure uses a flexible pivoting mechanism with the elevating element that can adjust its position to either expose or protect the wafer front surface. This flexibility allows the system to maintain a simple open structure while providing protective coverage when the elevating element is in the lock status
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces defects during wafer transfer by preventing damage from flipping and contamination from falling on the wafer, thereby improving fabrication yield.
Implementation Method 1
an elevating element disposed along the support baffle and pivoted to be movable between an unlock status and a lock status
Data Source
AI summary
A work piece holder provided herein includes a support baffle and an elevating element. The support baffle extends along an arc path. The elevating element is disposed on the support baffle and is pivoted to be movable between an unlock status and a lock status.