Wafer Holder Deformation for Nonlinear Lamination Alignment
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Solution Overview
Problem
Current substrate processing systems face challenges in accurately correcting misalignments and distortions during the lamination of wafers, particularly due to nonlinear distortions caused by factors like crystal anisotropy and manufacturing processes, which can lead to defects in semiconductor devices.
Innovation Solution
A substrate processing system that includes a measurement device for initial distortion measurement, a lamination device with a substrate correction device using actuators to deform the wafer holder, and a control unit to calculate and apply correction amounts, enabling precise alignment and lamination by measuring and correcting both linear and nonlinear distortions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional lamination processing is used without distortion correction, then the processing is simple and fast, but misalignment and defects occur due to nonlinear distortions from crystal anisotropy and manufacturing processes
Solution Approach 1:
The patent measures and corrects distortion of the first substrate before lamination processing. By performing preliminary distortion measurement and correction using actuators that deform the substrate holder, the system eliminates misalignment issues before they affect the final product, thereby improving manufacturing precision without requiring complex real-time correction systems during lamination
Solution Approach 2:
The patent employs a feedback mechanism where distortion is measured using alignment marks and measurement devices, then this measurement information is used to control actuators that apply corrective deformation. This closed-loop feedback system ensures high alignment accuracy while keeping the overall system architecture manageable through standardized feedback control
2Manufacturing precision
If distortion measurement and correction are performed, then alignment accuracy improves, but measurement and processing time increase
Solution Approach 1:
The patent performs distortion measurement and correction as preliminary steps before lamination. By measuring distortion of the first substrate in advance and applying correction through the substrate holder deformation, the system ensures accurate lamination without requiring time-consuming real-time adjustments during the actual bonding process
Solution Approach 2:
The patent changes physical parameters of the substrate holder using actuators to deform the holder and thereby correct substrate distortion. By adjusting parameters such as the shape and position of the holder surface, the system achieves rapid distortion correction without requiring complex multi-step processing, thus reducing overall processing time while maintaining high lamination accuracy
Data Source
AI summary
In a first aspect of the present invention, there is provided a substrate correction device which includes: an acquisition unit which acquires first information based on positional information of a plurality of alignment marks on a substrate, the alignment marks being measured externally; a stage which holds the substrate; a correction unit which corrects a misalignment between the substrate held by the stage, and another substrate to be bonded to the substrate; and a control unit which controls the correction unit based on the first information.