Wafer Holder Tape for Semiconductor Probe Testing
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Solution Overview
Problem
Current methods for testing semiconductor wafers face challenges in efficiently establishing electrical connections for probe testing, particularly when dealing with thinned wafers and stacked die configurations, which can lead to instability and reduced accuracy in quality assurance and reliability assessments.
Innovation Solution
The method involves using a wafer holder with a tape or film portion that includes openings for establishing electrical connections through conductive traces, allowing for secure mounting and testing of partial semiconductor wafers, including those with stacked die, by creating temporary conductive paths that maintain structural integrity and facilitate direct backside electrical interconnects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional mounting methods are used for probe testing, then the testing process is simple, but electrical connection stability and measurement precision deteriorate
Solution Approach 1:
The patent introduces a tape portion with conductive traces as an intermediary element between the wafer holder and the semiconductor wafer. This tape serves as a mediator that establishes stable electrical connections while accommodating thinned wafers and stacked die configurations, thereby improving measurement precision without requiring direct rigid contact
Solution Approach 2:
The mounting structure is segmented into distinct functional components: the wafer holder provides mechanical support, the tape portion with openings enables electrical access, and the conductive traces provide electrical pathways. This segmentation allows each component to optimize its specific function, improving overall connection stability
2Volume of moving object
If thinned wafers and stacked die are used to minimize package size, then the semiconductor device size is reduced, but handling stability and testing reliability worsen
Solution Approach 1:
The patent employs a flexible tape portion with openings that can adapt to thinned wafer configurations. This flexible film structure provides support and stability to thinned wafers and stacked die during handling and testing, preventing damage while maintaining the size reduction benefits
Solution Approach 2:
The mounting structure is designed with inherent cushioning and support features that protect thinned wafers before testing begins. The tape portion and holder configuration provide pre-established protection against handling damage, ensuring reliability throughout the testing process
3Adaptability or versatility
If multiple openings are created in the tape portion for electrical access, then electrical connection capability is improved, but structural integrity and manufacturing complexity worsen
Solution Approach 1:
The openings in the tape portion are pre-formed before the actual probe testing process. This preliminary action allows the tape to be prepared in advance with the required electrical access points, simplifying the manufacturing process and ensuring structural integrity is maintained throughout subsequent handling and testing operations
Data Source
AI summary
Implementations of methods of making a semiconductor device may include: providing a partial semiconductor wafer. The method may also include providing a wafer holder including a tape portion with one or more openings through the tape portion. The method may include mounting the partial semiconductor wafer over the one or more openings in the tape portion of the wafer holder and providing an electrical connection to the partial semiconductor wafer through the one or more openings in the tape portion during probe test.