Substrate Holder Transfer Timing for Faster Wafer Backside Cleaning
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Solution Overview
Problem
Current substrate processing devices face inefficiencies in throughput due to prolonged processing times for each substrate, particularly in cleaning operations where sequential handling and rotation stoppages hinder rapid processing of multiple substrates.
Innovation Solution
A substrate processing device and method that incorporates a first substrate holder, a second substrate holder positioned lower, a rotation driver, a brush cleaner, and controllers to synchronize the cleaning and transfer operations, allowing the brush cleaner to clean the substrate's center and outer regions while the second holder rotates, and then transferring the substrate with overlapping rotation stop and moving operations to optimize processing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the substrate is cleaned sequentially by first cleaning the center region then the outer region with the second substrate holder rotating, then cleaning quality is improved, but processing time increases and throughput decreases
Solution Approach 1:
The second substrate holder is rotated in advance during the cleaning of the center region, so that when the substrate is transferred to the second holder, it is already in the correct rotational position and ready for immediate outer region cleaning, eliminating idle time
Solution Approach 2:
The rotation of the second substrate holder continues uninterrupted during the entire cleaning process - both during center region cleaning and outer region cleaning - ensuring continuous substrate movement and preventing processing delays
2Manufacturing precision
If the second substrate holder stops rotation during substrate transfer, then transfer precision is improved, but processing time increases
Solution Approach 1:
The rotation of the second substrate holder is stopped in advance before the substrate transfer begins, so that the holder is already stationary and positioned correctly when the substrate arrives, enabling precise transfer without requiring additional stopping time
Solution Approach 2:
The substrate transfer is performed rapidly during the brief period when the second holder is stationary, minimizing the time lost to transfer operations while maintaining precision
3Productivity
If the brush cleaner cleans both center and outer regions while the second substrate holder rotates, then cleaning efficiency is improved, but the complexity of coordinating multiple operations increases
Solution Approach 1:
The brush cleaner is designed with dual functionality - it can clean both the center region (when substrate is on first holder) and the outer region (when substrate is on second holder) using the same brush mechanism, eliminating the need for separate cleaning devices
Solution Approach 2:
The controller monitors the positions and states of the first substrate holder, second substrate holder, and brush cleaner, and dynamically adjusts their operations to ensure coordinated cleaning and transfer actions, managing complexity through intelligent control
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces processing time per substrate by overlapping critical operational periods, thereby enhancing the throughput of substrate processing and improving overall efficiency.
Implementation Method 1
a brush cleaner (50) configured to bring a brush into contact with the lower-surface center region of the substrate held by the first substrate holder (10A, 10B) to clean the lower-surface center region and bringing the brush into contact with a lower-surface outer region surrounding the lower-surface center region of the substrate held by the second substrate holder (20) to clean the lower-surface outer region
Implementation Method 2
a rotation driver configured to rotate the second substrate holder about an axis extending in an up-and-down direction
Implementation Method 3
a horizontal mover configured to perform a horizontal moving operation of changing a relative positional relationship between the first substrate holder and the second substrate holder in a horizontal plane
Data Source
Figure 1
Figure 2
Figure 3~4
AI summary
A substrate is held by an upper holding device, and a lower-surface center region of the substrate is cleaned. During this cleaning, a suction holder of a lower holding device located below the upper holding device is rotated. The substrate held by the upper holding device is transferred to a suction holder of the lower holding device. A lower-surface outer region of the substrate held by the suction holder is cleaned. After the lower-surface center region of the substrate is cleaned and until the substrate is transferred to the suction holder of the lower holding device, rotation of the lower holding device is stopped. Further, the suction holder is moved in a horizontal direction by a base device. A rotation stopping operation for the suction holder and a horizontal moving operation for the suction holder are performed such that the periods for these operation at least partially overlap with each other.