Wafer ID Mapping Eliminates Laser Marking Defects
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Solution Overview
Problem
The formation of laser marks on wafers during semiconductor manufacturing can lead to particle attachment and non-uniform thickness issues during etching and scratching problems in polishing processes, affecting the yield and time of semiconductor device manufacturing.
Innovation Solution
A system and method where the wafer identification (ID) assigned by a wafer manufacturing company is mapped as an ID code by a semiconductor manufacturing company, eliminating the need for a laser marking process, and using a photoresist film to expose the wafer edge portion to form a semiconductor integrated circuit layer without the semiconductor manufacturing company's laser marking process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of information
If a laser mark is formed by irradiating a pulse laser to an edge portion of the wafer, then identification information (LOT numbers, company ID) can be marked on the wafer, but particles are attached to the wafer causing non-uniform thickness in etching and scratches in polishing
Solution Approach 1:
The patent extracts the harmful laser marking process from the wafer treatment sequence. Instead of forming laser marks on wafers, the system uses wafer IDs provided by the wafer manufacturer and maps them to internal identification systems, completely removing the source of particle contamination while preserving identification functionality through database mapping.
Solution Approach 2:
The patent introduces a database as an intermediary between the wafer ID and the manufacturing process. The database stores the mapping between wafer IDs and LOT numbers, allowing identification information to be accessed without physically marking the wafer. This intermediary system enables information retrieval without direct contact or laser interaction with the wafer surface.
2Loss of information
If a laser mark is formed on the wafer, then the wafer can be identified by LOT numbers and company ID, but the laser marking process increases manufacturing time and reduces yield
Solution Approach 1:
The patent removes the time-consuming laser marking step from the manufacturing process. By using pre-existing wafer IDs and implementing a database mapping system, the process eliminates the sequential laser marking operation that previously added to cycle time and reduced overall manufacturing productivity.
Solution Approach 2:
The patent utilizes identification information that is already present on the wafer from the manufacturing stage. The wafer ID is assigned by the wafer manufacturer before delivery, and the mapping to LOT numbers is pre-established in the database, eliminating the need for subsequent laser marking operations during the semiconductor manufacturing process.
Data Source
AI summary
A system for processing a wafer may use a wafer identification (ID) assigned by a wafer manufacturing company as an ID code of the wafer in managing the wafer by a semiconductor manufacturing company.