Wafer Image Alignment for Automated Dividing-Line Map Generation
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Solution Overview
Problem
The existing dicing and laser processing apparatuses require manual effort to generate a wafer map by coupling multiple images captured by the imaging unit, which is time-consuming and labor-intensive.
Innovation Solution
A processing apparatus equipped with a control unit that includes sections for detecting planned dividing lines, setting intervals, generating device images, extracting reticle images through phase only correlation, and generating a wafer map by coupling reticle images.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual image coupling is used to generate wafer map, then map information can be obtained, but time consumption and labor intensity increase significantly
Solution Approach 1:
The patent replaces the manual mechanical process of image coupling with an automated optical system. The imaging unit captures wafer images, and the control unit automatically processes these images to generate map information, eliminating manual intervention and significantly reducing time consumption while maintaining accuracy.
Solution Approach 2:
The system performs self-service by automatically generating wafer map information through the control unit's image processing capabilities. The imaging unit and control unit work together autonomously to capture, process, and generate map data without requiring external manual operation, thus reducing labor intensity and time requirements.
2Measurement precision
If manual image coupling is used to generate wafer map, then map information can be obtained, but operational complexity and effort increase
Solution Approach 1:
The patent replaces complex manual operations with an automated control system that handles image capture and processing. The control unit automatically generates map information from captured images, eliminating the need for operators to manually couple images, thereby significantly improving ease of operation while maintaining measurement precision.
Solution Approach 2:
The system performs self-service by autonomously generating wafer map information through integrated imaging and control units. The automatic image processing eliminates the need for manual operational intervention, making the map generation process simple and easy to operate while maintaining high accuracy.
3Productivity
If automated image processing is implemented, then time and effort are reduced, but system complexity increases
Solution Approach 1:
The control unit serves multiple functions: it controls the imaging unit to capture wafer images, processes these images to generate map information, and manages the overall mapping process. This multi-functionality consolidates what could be separate complex systems into a single integrated unit, improving productivity while managing device complexity through functional integration.
Solution Approach 2:
The patent merges the imaging function and image processing function into an integrated system. The imaging unit and control unit work as a unified system where image capture and map generation are combined, reducing the need for separate complex subsystems and achieving high productivity with controlled system complexity.
Data Source
AI summary
A control unit of a processing apparatus detects a linear region corresponding to a first planned dividing line from an intersection region of the first planned dividing line and a second planned dividing line, obtains an angle between the linear region and an X-axis direction, and positions the linear region corresponding to the first planned dividing line in the X-axis direction. A linear region corresponding to a next first planned dividing line is detected and an interval between the first planned dividing lines is set. A second planned dividing line interval setting section detects two linear regions corresponding to second planned dividing lines, the linear regions being adjacent to each other, and an interval is set between the second planned dividing lines. A device image enclosed by a pair of first planned dividing lines and a pair of second planned dividing lines is generated and stored.