Single-Wafer Immersion Spin Cleaning Without Wafer Transfer
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Solution Overview
Problem
The current wafer cleaning process is complicated and time-consuming due to the need for multiple devices and frequent wafer transfers, which increases production costs and risks wafer damage.
Innovation Solution
A multifunctional single wafer soaking-spinning-cleaning device with a wafer support disk that ascends and descends to facilitate soaking, spinning, and cleaning, allowing for continuous processes without the need for transfer robots.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a conventional cleaning process uses multiple devices for soaking and spin cleaning, then the cleaning effectiveness is improved, but the device complexity and processing time increase
Solution Approach 1:
The patent combines the soaking tank and spin clean chamber into a single integrated device. The soaking tank is positioned within the spin clean chamber, allowing both soaking and spin cleaning operations to be performed in one device rather than requiring separate devices. This merging eliminates the need for transfer robots and reduces process complexity while maintaining cleaning effectiveness.
Solution Approach 2:
The spin clean chamber is designed to serve multiple functions: it acts as both the spin cleaning chamber and the soaking tank container. The soaking tank itself serves dual purposes as both a container and the actual soaking chamber. This multi-functionality reduces the number of dedicated devices needed while maintaining all necessary cleaning capabilities.
2Reliability
If wafer is transferred between multiple devices, then the cleaning process is completed, but the processing time and production costs increase
Solution Approach 1:
By merging the soaking tank and spin clean chamber into one integrated device, the wafer remains in a single device throughout the entire cleaning process. This eliminates transfer time between devices and reduces production costs associated with multiple device operations while still completing all necessary cleaning steps.
Solution Approach 2:
The integrated design allows continuous processing where the wafer undergoes soaking and spin cleaning without interruption or transfer. The process flows continuously within the single device, eliminating idle transfer time and maintaining productive action throughout the cleaning sequence.
3Reliability
If wafer is transferred between devices, then the cleaning steps are completed, but the risk of wafer damage increases
Solution Approach 1:
The integrated device eliminates the need for wafer transfer between separate soaking and spin cleaning devices. By keeping the wafer in one device throughout the process, the risk of mechanical damage during transfer is eliminated while still completing all necessary cleaning steps.
Solution Approach 2:
The wafer remains in the same device that performed the soaking step and now performs the spin cleaning step. The device serves the wafer continuously without external intervention or transfer, reducing handling and associated damage risks.
4Productivity
If a single device performs multiple cleaning steps, then the productivity is improved, but the device complexity increases
Solution Approach 1:
The device is segmented into distinct functional zones: the soaking tank area and the spin clean chamber area. This segmentation allows each zone to perform its specific function while being part of an integrated system. The soaking tank can be removed or accessed independently if needed, providing modular complexity management.
Solution Approach 2:
The spin clean chamber serves as both the cleaning chamber and the container for the soaking tank. This universal design allows one structure to fulfill multiple roles, improving productivity without proportionally increasing device complexity. The soaking tank itself is both a container and the soaking chamber.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device simplifies the wafer cleaning process, reduces processing time and costs, and minimizes wafer damage by enabling continuous soaking, spinning, cleaning, and drying on a single wafer spin chuck.
Implementation Method 1
a spin driver device; a wafer spin chuck connected to the spin driver device, driven by the spin driver device to spin
Data Source
AI summary
A wafer processing method is provided. The method includes a device providing step, a first lifting step, a wafer placing step, a second lifting step, a soaking step, and a third lifting steps, and a spinning cleaning step. The device providing step includes providing a multifunctional single wafer immersion and spin cleaning device, the device has a spin drive device, a wafer turntable, and a wafer receiving tray. A soaking tank is formed on the wafer receiving tray, and a watertight contact gasket is disposed on the wafer receiving tray to contact the wafer water-tightly such that in the soaking step, an appropriate water level of the liquid medicine can be accumulated to fully soak the wafer.