Wafer Imprint Sequencing for Uniform Resist Pattern Transfer
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Solution Overview
Problem
Current imprint methods for semiconductor device manufacturing are inefficient due to the need for repeated movement of the wafer stage between resist dropping and stamping positions, leading to increased processing time and potential variations in resist pattern formation across different shot regions.
Innovation Solution
An imprint apparatus that divides the substrate into sections, allowing for simultaneous dropping of resist onto multiple shot regions and sequential stamping with a template, while controlling processing parameters based on the elapsed time for each region to optimize resist spreading and curing, thereby reducing waste and improving pattern consistency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the wafer stage is moved repeatedly between resist dropping and stamping positions for each shot region, then the imprint process can be completed, but the processing time increases and manufacturing efficiency decreases
Solution Approach 1:
The substrate is divided into multiple shot regions, and resist is dropped onto multiple shot regions simultaneously or in parallel. This segmentation allows different regions to be processed concurrently, reducing the total number of sequential movements required and improving manufacturing efficiency.
Solution Approach 2:
Multiple resist dropping operations for different shot regions are combined into a single simultaneous operation. By dropping resist onto multiple shot regions at the same time, the system reduces the total processing time and minimizes repeated movements of the wafer stage, thereby improving productivity.
2Manufacturing precision
If the wafer stage moves frequently between different positions, then all shot regions can be processed, but variations in resist pattern formation occur across different shot regions
Solution Approach 1:
Resist is dropped onto multiple shot regions simultaneously before the stamping process begins. This preliminary action ensures that all shot regions receive resist under the same conditions, eliminating variations caused by sequential dropping and repeated stage movements, thereby improving pattern consistency.
Solution Approach 2:
The resist dropping process is made continuous by dropping resist onto multiple shot regions at the same time. This eliminates interruptions and repeated movements between shot regions, maintaining consistent processing conditions across all regions and improving both pattern consistency and efficiency.
3Loss of time
If resist is dropped sequentially onto each shot region, then the process is simple to control, but the total processing time increases
Solution Approach 1:
The processing parameters are changed by dropping resist onto multiple shot regions simultaneously rather than sequentially. This parameter change in the timing and positioning of resist dropping reduces total processing time while the control system manages the complexity through coordinated multi-point deposition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables more efficient imprint processing by minimizing movement distances, reducing processing time, and achieving consistent resist pattern formation across multiple shot regions, thereby enhancing the manufacturing efficiency and quality of semiconductor devices.
Implementation Method 1
the resist is cured by being irradiated with an ultraviolet ray
Data Source
AI summary
According to one embodiment, an imprint apparatus that presses a fine pattern of an original plate against a photo-curable resin dropped onto a substrate, and transfers the fine pattern to the photo-curable resin by applying light, includes a dropping unit that drops the photo-curable resin onto a shot region obtained by dividing the substrate into a plurality of sections, an original plate supporting unit that stamps the original plate on the photo-curable resin on the substrate, the original plate being supported the fine pattern towards the substrate side, and a substrate supporting unit that supports the substrate and moves the substrate such that a position of a predetermined shot region of the substrate is a dropping position of the dropping unit or a stamping position of the original plate, in which the dropping unit is controlled such that the photo-curable resin is sequentially dropped onto the plurality of shot regions of the substrate, and the original plate supporting unit is controlled such that the fine pattern is transferred by sequentially stamping the original plate on the photo-curable resin dropped onto the plurality of shot regions, while operating the substrate supporting unit.