Wafer Inspection Using Single Light Source and Robotic Arm
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Solution Overview
Problem
Existing wafer inspection systems are costly, complex, and inefficient in detecting wafer deposition statuses such as incline, overlap, absence, and warp, often requiring multiple light sources and manual adjustments, leading to high installation costs and potential damage during removal and deposition.
Innovation Solution
A robotic arm equipped with a single image capture device and light flashing device, where the image capturing and light projecting directions align with the robotic arm's gripping direction, projects light onto the wafer to generate a light-reflecting contour, allowing for efficient detection of wafer deposition statuses through image analysis.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If optical image recognition systems with two light sources are used, then inspection accuracy is improved, but system complexity and cost increase
Solution Approach 1:
The patent extracts and eliminates one of the two light sources from the inspection system, retaining only a single light source while maintaining inspection accuracy through optimized light projection geometry and image capture timing
Solution Approach 2:
The patent employs periodic action by synchronizing the light source activation with the image capture timing, where the light flashes momentarily when the robotic arm is in the inspection position, eliminating the need for continuous illumination and reducing system complexity
2Measurement precision
If two light sources are used for inspection, then recognition accuracy is improved, but installation cost and adjustment complexity increase
Solution Approach 1:
The patent removes one light source from the system, reducing component count and installation cost while maintaining recognition accuracy through the single light source combined with synchronized image capture
Solution Approach 2:
The single light source is designed to serve multiple functions: providing illumination for contour detection, creating appropriate shadow patterns for defect identification, and working in conjunction with the robotic arm's movement to achieve comprehensive inspection coverage
3Measurement precision
If two light sources with adjustable illumination angles are used, then inspection quality is improved, but system complexity and space requirements increase
Solution Approach 1:
The patent eliminates one light source and its associated adjustment mechanisms, reducing the spatial footprint of the inspection system while maintaining inspection quality through the single light source positioned optimally relative to the robotic arm's gripping direction
Solution Approach 2:
The patent makes the inspection system dynamic by coupling the single light source to the robotic arm's movement, where the light source moves with the arm to maintain optimal illumination angles throughout the inspection process, eliminating the need for fixed multi-angle light sources
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables low-cost, easy installation, and efficient identification of wafer deposition statuses, overcoming the inefficiencies and high costs of prior systems while preventing wafer damage during handling.
Implementation Method 1
when light is projected onto a wafer, a light-reflecting contour is generated on the wafer to be captured by the image capture device captures as a wafer contour image
Data Source
AI summary
A wafer position status inspection apparatus includes a wafer transportation device, a robotic arm rotatably mounted on the wafer transportation device, an image capture device arranged on the robotic arm, a light flashing device arranged at one side of the image capture device, and a status inspection section in information connection with the image capture device. An image capturing direction of the image capture device is set consistent with a gripping direction of the robotic arm, and a light projecting direction of the light flashing device is consistent with the image capturing direction. The light flashing device projects light on a wafer to generate a light-reflecting contour, which is captured by the image capture device to form a wafer contour image based on which the status inspection section acquires a wafer deposition status to identify various wafer statuses including incline, overlap, absence, and warp.