Wafer Inspection System with Movable Register Elements
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Solution Overview
Problem
Modern wafer inspection systems face challenges in efficiently and accurately inspecting wafers of different sizes and types, requiring adaptations to handle various frame sizes and shapes, and ensuring high-speed, reliable, and repeatable processes.
Innovation Solution
A wafer inspection system incorporating a chuck with a porous interface plate and a robot that uses detachable adaptors and movable register elements to support and position wafers and frames of different sizes, employing vacuum technology and adjustable supporting pins to ensure precise alignment and inspection, and a method for translating and inspecting wafers that automatically adjusts to the size and shape of the objects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a single fixed chuck design is used, then the device complexity is reduced, but the adaptability to handle different wafer sizes and frame shapes deteriorates
Solution Approach 1:
The chuck incorporates movable supporting pins that can be adjusted to different positions and heights, allowing the same chuck to adapt to various wafer sizes and frame shapes. The pins can move dynamically to contact different locations on the object being inspected, providing versatility without requiring multiple fixed chuck designs.
Solution Approach 2:
The chuck is designed as a universal holder that can accommodate multiple types of objects including wafers of different diameters and frames of different sizes and shapes. By combining the adjustable supporting pins with a common base structure, the system achieves multi-functionality while controlling overall device complexity.
2Productivity
If manual wafer handling is used, then the ease of operation is improved, but the productivity and inspection speed deteriorate
Solution Approach 1:
The system employs automatic robot arms that can independently fetch wafers from cassettes, place them on the chuck, and remove them after inspection. The movable supporting pins automatically adjust to support the object, reducing the need for manual intervention while maintaining ease of operation through automated self-adjusting mechanisms.
Solution Approach 2:
Manual mechanical handling operations are replaced with automated robotic systems that use controlled mechanical movements to transfer and position wafers. This substitution increases productivity while the automated control systems maintain ease of operation through programmable sequences.
3Reliability
If vacuum is applied strongly to hold the wafer, then the reliability of wafer holding is improved, but the risk of wafer damage or chipping worsens
Solution Approach 1:
Instead of applying vacuum uniformly across the entire wafer surface, the system applies vacuum locally through the porous interface plate only at the areas where the wafer contacts the chuck. This localized vacuum application provides sufficient holding reliability while minimizing the risk of damage to the wafer edges and diced portions.
Solution Approach 2:
The chuck incorporates a porous interface plate that allows vacuum to be applied through its porous structure. This enables distributed vacuum application across the contact areas, providing reliable wafer holding while reducing stress concentration that could cause chipping or damage to the wafer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system enables fast and accurate inspection of non-diced wafers and frames supporting diced wafers, adapting to different sizes and shapes, ensuring high repeatability and efficiency by automating pre-inspection stages and using vacuum and air puff mechanisms to prevent chipping, thus enhancing the overall inspection process.
Implementation Method 1
a porous interface plate adapted to support a object, wherein through the porous interface plate vacuum is developed
Implementation Method 2
through the porous interface plate vacuum is developed
Implementation Method 3
at least one vacuum groove adapted to apply vacuum on a tape that supports the diced wafer
Data Source
AI summary
A method for inspecting a wafer and a system. The system includes: a chuck; and a robot that includes a movable element connected to a detachable adaptor selected from a group of diced wafer detachable adaptors and non-diced wafer detachable adaptors; wherein a diced wafer detachable adaptor is shaped such to partially surround the diced wafer and comprises at least one vacuum groove adapted to apply vacuum on a tape that supports the diced wafer; and wherein the robot is adapted to fetch the wafer from a cassette and to place the wafer on the chuck.