Wafer Inspection Probe Alignment via Inclination Adjustment
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Solution Overview
Problem
Conventional wafer inspection devices face challenges in maintaining accurate contact between probe cards and wafers under high-temperature or low-temperature environments due to thermal expansion or contraction, leading to potential misalignment and difficulty in uniform contact with electrode pads or solder bumps.
Innovation Solution
A wafer inspection device equipped with an aligner and inclination checking mechanism, which adjusts the inclination of the chuck top relative to the probe card using cameras to ensure parallel alignment, allowing for precise contact even under temperature variations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a probe card or chuck top is used under high-temperature or low-temperature environments, then inspection can be performed under various temperature conditions, but thermal expansion or contraction causes deformation and inclination, making it difficult to maintain parallel relationship between wafer and probe card
Solution Approach 1:
The inclination checking mechanism checks the degrees of inclination of the chuck top and probe card before the wafer contact process, and the inclination adjusting mechanism adjusts the inclination in advance to ensure parallel alignment is achieved before inspection begins
Solution Approach 2:
The inclination checking mechanism provides real-time feedback on the inclination degrees of the chuck top and probe card, allowing the inclination adjusting mechanism to continuously adjust and maintain proper alignment during temperature variations
2Reliability
If the chuck top is made thick to prevent wafer wrapping during contact, then wafer wrapping is prevented, but the weight and inertia of the chuck top increase, affecting positioning accuracy and response speed
Solution Approach 1:
The inclination adjusting mechanism dynamically adjusts the inclination of the chuck top based on real-time feedback from the inclination checking mechanism, allowing the system to adapt to temperature changes and maintain alignment without requiring excessive thickness
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables uniform contact with semiconductor device terminals, ensuring accurate wafer inspection by maintaining the wafer in a parallel relationship with the probe card, even when the probe card or chuck top is inclined, thus improving inspection efficiency and accuracy.
Implementation Method 1
an inclination checking mechanism configured to check a degree of inclination of the chuck top and a degree of inclination of the probe card, wherein the inclination checking mechanism includes the first camera and a second camera
Implementation Method 2
the first camera being configured to check the degree of inclination of the chuck top and the second camera being disposed in the aligner and configured to check the degree of inclination of the probe card
Implementation Method 3
the aligner includes an inclination adjusting mechanism configured to adjust an inclination of the chuck top relative to the probe card
Data Source
AI summary
The present disclosure provides a wafer inspection device that can perform accurate inspection. The wafer inspection device includes a probe card having a plurality of contact probes formed to protrude toward a wafer W, a chuck top on which the wafer W is mounted and configured to move toward the probe card, and an aligner configured to adjust inclination of the chuck top relative to the probe card.