Wafer Inspection with Random Illumination for Periodic Patterns

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing wafer inspection techniques struggle to acquire high-resolution images when micropatterns on the wafer surface are periodic, as multiple diffraction pattern images become identical, hindering effective imaging.

Innovation Solution

A wafer inspection apparatus utilizing a spatial light modulator to output light in a random pattern, combined with a 4F optical system and a detector, allows for the acquisition of multiple diffraction images by changing the position of a random pattern image without moving the wafer, thereby capturing high-resolution images even with periodic patterns.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional diffraction imaging is used with periodic micropatterns, then the imaging process is simple, but all diffraction pattern images become identical and high-resolution imaging fails

Engineering Contradiction:
Improveimaging resolutionVSAvoidoptical system complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

A random pattern generator is introduced as an intermediary component between the light source and the wafer. This generator creates random illumination patterns that modulate the periodic micropatterns, transforming identical diffraction images into diverse patterns that enable high-resolution reconstruction through computational algorithms.

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The illumination parameters are dynamically changed by varying the random pattern across multiple measurements. Instead of using uniform or periodic illumination, the system employs statistically random illumination patterns with controlled parameters (such as spatial frequency content and intensity distribution) to encode different information about the periodic structures.

Inventive Principle:
Principle #35Parameter changes

2Measurement precision

If multiple diffraction images are acquired to improve resolution, then imaging quality improves, but the wafer must be moved or rotated which increases measurement time

Engineering Contradiction:
Improveimaging resolutionVSAvoidmeasurement time
Core Design Contradiction:
Measurement precisionVSLoss of time

Solution Approach 1:

The mechanical system for moving or rotating the wafer is replaced with an optical system that projects different random patterns onto the stationary wafer. The spatial light modulator or acoustic optical modulator dynamically changes the illumination pattern without requiring any mechanical movement of the sample, thereby acquiring multiple diffraction images in rapid succession.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The system employs periodic modulation of the random illumination patterns at high frequencies. By rapidly switching between different random patterns (effectively creating a time-periodic illumination sequence), the system accumulates multiple diffraction measurements during a single wafer position, enabling high-resolution reconstruction without mechanical movement.

Inventive Principle:
Principle #19Periodic action

3Measurement precision

If random pattern illumination is used to generate diverse diffraction images, then high-resolution imaging of periodic patterns is achieved, but the optical system complexity increases

Engineering Contradiction:
Improveimaging resolutionVSAvoidspatial light modulator complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The random pattern generator is designed to serve multiple functions: it illuminates the wafer, modulates the periodic patterns, and encodes spatial frequency information. A single optical component (such as a spatial light modulator) performs what would otherwise require multiple separate systems, reducing overall system complexity while achieving the desired imaging capability.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

Instead of physically moving the wafer to capture different views, the system creates optical copies of the diffraction pattern under different random illuminations. The spatial light modulator generates multiple virtual illumination configurations that mimic the effect of physical repositioning, thereby achieving diverse diffraction images without mechanical complexity.

Inventive Principle:
Principle #26Copying

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables the acquisition of high-resolution images of wafer surfaces with periodic patterns by generating diverse diffraction images through controlled manipulation of the random pattern image, enhancing imaging capabilities.

Implementation Method 1

a spatial light modulator behind an image surface and configured to receive first light from the light source and output second light in a random pattern

Methodology Applied
Scientific EffectLight modulation:

Implementation Method 2

an objective lens configured to focus the second light onto an illuminated region of the wafer

Methodology Applied
Scientific EffectLight focusing: Lens

Implementation Method 3

detector behind a detection surface and configured to acquire a diffraction image formed on the detection surface based on focused third light reflected from a detection region of the wafer

Methodology Applied
Scientific EffectDiffraction: Diffraction

Implementation Method 4

focused third light reflected from a detection region of the wafer

Methodology Applied
Scientific EffectLight reflection: Reflection

Data Source

PatentUS20260049950A1Wafer inspection apparatus
Publication Date: 2026.02.19 SAMSUNG ELECTRONICS CO LTD
  • US20260049950A1 patent drawing
  • US20260049950A1 patent drawing
  • US20260049950A1 patent drawing

AI summary

A wafer inspection apparatus includes a light source configured to output first light, a spatial light modulator behind an image surface, the spatial light modulator configured to receive the first light and output second light that is in a random pattern, an optical system configured to provide the second light to an illuminated region of a wafer that is behind a sample surface, and a detector behind a detection surface and configured to acquire a diffraction image formed on the detection surface by reflection of the second light from a detection region within the illuminated region of the wafer, where each of the sample surface, the detection surface, and the image surface is a virtual plane that is set in a direction perpendicular to a traveling direction of the second light.