Wafer Inspection Using Identification Tags for Surface Contaminant Mapping
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Solution Overview
Problem
Existing semiconductor device manufacturing methods face challenges in reliably inspecting wafer surfaces for foreign substances and measuring the distribution of organic compounds during cleaning processes.
Innovation Solution
A wafer inspection method that captures images of the wafer and an identification tag, quantifies the tag to obtain an inspection profile, and performs surface inspections based on the profile, allowing for real-time monitoring and high reliability in detecting foreign substances and organic compound distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional wafer inspection methods are used, then inspection processes can be performed, but reliability in detecting foreign substances and organic compound distribution is insufficient
Solution Approach 1:
The patent introduces an identification tag as an intermediary object placed on the wafer surface. This tag serves as a reference marker that enables precise localization and quantitative measurement of foreign substances and organic compound distribution. The tag acts as a mediator between the inspection system and the wafer surface, allowing for reliable detection by providing known reference points for comparison and measurement calibration.
Solution Approach 2:
The patent creates a reference image by capturing an image of the identification tag on a reference wafer, and then compares it with an inspection image from the target wafer. This copying approach allows for quantitative measurement by comparing the tag's appearance in both images, enabling precise detection of changes in foreign substance presence and organic compound distribution without directly measuring the complex wafer surface.
2Ease of manufacture
If multiple separate processes (cleaning and drying) are used, then foreign substances can be removed, but the process complexity and time increase
Solution Approach 1:
The patent combines the cleaning process monitoring and inspection into a single integrated process. By placing the identification tag on the wafer before cleaning and performing inspection during or after the cleaning process, the system eliminates the need for separate drying and inspection steps. The organic compound distribution measured through the tag provides information about cleaning effectiveness, merging multiple functions into one efficient process flow.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enables reliable and real-time inspection of wafer surfaces, effectively detecting foreign substances and measuring organic compound distribution, thereby improving the quality and efficiency of semiconductor device manufacturing.
Implementation Method 1
obtaining an inspection image by capturing an image of a wafer and an identification tag
Data Source
AI summary
A wafer inspection method includes: obtaining an inspection image by capturing an image of a wafer and an identification tag; obtaining an inspection profile by quantifying the identification tag in the inspection image; and performing a surface inspection of the wafer based on the obtained inspection profile.