Wafer Inspection Apparatus Automated Threshold Segmentation
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Solution Overview
Problem
The existing wafer appearance inspection apparatus requires excessive manual effort and time to set sensitivity thresholds for numerous in-die inspection areas, leading to inefficiencies and potential human errors due to the need for repetitive operations and high labor costs.
Innovation Solution
The apparatus employs image processing to compute pixel deviations and match patterns, allowing for automated segmentation and sensitivity threshold setting across regions, thereby reducing manual intervention and enhancing inspection efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If manual segmentation and sensitivity threshold setting is performed for each in-die inspection area, then inspection accuracy is enhanced, but time consumption and labor requirements increase excessively
Solution Approach 1:
The patent divides the wafer surface into multiple in-die inspection areas and further segments each area into sub-areas with different sensitivity threshold requirements. This segmentation enables targeted inspection strategies for different regions, improving accuracy while the automated system manages the complexity of multiple segments efficiently
Solution Approach 2:
The patent creates template images representing typical surface profiles and defect patterns. These templates are copied and matched across multiple inspection areas, allowing the system to automatically determine appropriate sensitivity thresholds for each region without manual intervention, thus reducing time consumption while maintaining accuracy
2Measurement precision
If manual segmentation and sensitivity threshold setting is performed for each in-die inspection area, then inspection accuracy is enhanced, but labor requirements increase excessively
Solution Approach 1:
The system performs self-service by automatically segmenting inspection areas and determining sensitivity thresholds through template matching algorithms. The apparatus processes images, identifies patterns, and configures inspection parameters autonomously, eliminating the need for extensive manual labor while achieving enhanced inspection accuracy through region-specific thresholds
Solution Approach 2:
Template images representing characteristic surface profiles are created once and then copied across multiple inspection areas. The system automatically matches these templates to determine appropriate sensitivity thresholds for each region, replacing manual repetitive operations with automated pattern recognition and copying
3Ease of operation
If sensitivity thresholds are uniformly set across all inspection areas, then operation simplicity is maintained, but inspection accuracy decreases due to mixed contrast regions
Solution Approach 1:
The patent implements local quality by assigning different sensitivity thresholds to different inspection areas based on their specific characteristics. High contrast regions receive appropriate threshold settings optimized for their properties, while low contrast regions receive different settings, thereby maintaining operation simplicity through automated classification while achieving high inspection accuracy through region-specific parameters
4Productivity
If automated pattern matching is implemented to reduce manual work, then productivity increases, but device complexity increases
Solution Approach 1:
The patent employs template copying and matching algorithms that, while computationally intensive, are implemented through standardized image processing routines. The system creates templates from sample areas and copies/matches them across the entire wafer surface, achieving high productivity through automated pattern recognition. The complexity is managed by using established image processing techniques rather than developing custom complex algorithms
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables expedited and accurate setting of sensitivity thresholds for each region, significantly improving the inspection efficiency and reducing the burden of manual work, while maintaining high accuracy.
Implementation Method 1
Light is irradiated to a wafer, and light having detected reflected light is displayed as an image in an image display portion
Data Source
AI summary
Provided is a wafer appearance inspection apparatus that can segmentize an inspection target region, enable expedited execution of an operation to set a sensitivity threshold to each region, and enhance the inspection efficiency. Pattern matching between the image region of a part of a standard wafer, which is defined as a template region, and the entire image region of the standard wafer is performed to compute an image editing value. The computed image editing value is used to edit an inspection target image. A region for which a threshold is to be set can be automatically confirmed by roughly specifying the region from among edited image regions displayed on the display. The confirmed region and a similar pattern region are searched and displayed. When the similar region is selected, the initial sensitivity threshold is displayed, and a change is made on an as-needed basis. The region of the set sensitivity threshold is displayed by the display color corresponding to the determined threshold. Inspection is executed according to the set threshold.