Semiconductor Wafer Insulating Layer Segmentation for Air Venting
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Solution Overview
Problem
The existing production methods of semiconductor devices can damage the wafer due to air expansion when a protective tape is applied, causing clearance between the wafer and the tape, especially during vacuum processing.
Innovation Solution
A method involving the formation of a dicing line groove and a communication groove on the semiconductor wafer, which allows air to escape through these grooves when a protective tape is applied, preventing air from being sealed and thus preventing damage during processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a protective tape is attached to the front side surface of the semiconductor wafer, then the front side surface is protected, but air is sealed in the clearance between the wafer and the protective tape at the step between the electrode and the insulating layer
Solution Approach 1:
The insulating layer is divided into a first insulating layer and a second insulating layer. The first insulating layer is formed at a first height, and the second insulating layer is formed at a second height lower than the first height. This segmentation creates a stepped structure that prevents air from being sealed in the clearance between the wafer and the protective tape, while still providing protection to the front side surface.
2Ease of manufacture
If the back side of the semiconductor wafer is processed under vacuum environment, then processing is enabled, but the sealed air expands and damages the semiconductor wafer
Solution Approach 1:
The insulating layer is segmented into two levels, creating a stepped structure that allows air to escape during vacuum processing. This prevents air expansion damage while enabling back side processing under vacuum environment.
Solution Approach 2:
The stepped insulating layer structure is formed in advance before vacuum processing. This preliminary structural preparation ensures that air can escape during subsequent vacuum processing, preventing wafer damage while enabling the processing to proceed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enhances the fabrication yield of semiconductor devices by preventing damage from air expansion and reducing defects during the production process.
Implementation Method 1
when the back side of the semiconductor wafer is processed, if the semiconductor wafer is placed under a vacuum environment, the air sealed in the clearance may expand
Data Source
AI summary
A semiconductor wafer, includes: a plurality of element regions; a surface electrode that is disposed in each of the plurality of element regions; an insulating layer that is disposed in each of the plurality of element regions and of which height from a front side surface of the semiconductor wafer is higher than that of the surface electrode in a periphery of the surface electrode; and a dicing line groove that is formed in a front side surface of the semiconductor wafer, that surrounds the surface electrode with the insulating layer therebetween, of which height from the front side surface of the semiconductor wafer is lower than that of the insulating layer, and that extends to a perimeter of the semiconductor wafer; in which the insulating layer is formed with a communication passage that extends from a side of the surface electrode to the dicing line groove.