Wafer Inversion Mechanism for Semiconductor Substrate Handling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing systems for inspecting or processing the backside of semiconductor substrates are costly and limited in utility, as they require specialized equipment for the non-active side, making it desirable to invert substrates for standard front-side system use.
Innovation Solution
A BOLTS compatible wafer inverter module with a support mechanism and rotary mechanism for 180° rotation, coupled with edge grip mechanisms that securely grasp substrates using reciprocating gripping members to facilitate inversion and handling within SEMI standard handling systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If specialized systems are used for inspecting or processing the backside of semiconductor substrates, then inspection or processing of the backside can be performed, but the system cost increases and utility is limited
Solution Approach 1:
The patent applies inversion by flipping the substrate 180 degrees to access the backside using standard front-side systems. The wafer inverter mechanism rotates the substrate holder half a turn, allowing the backside to be positioned where the frontside would normally be inspected, thereby eliminating the need for specialized backside inspection equipment.
2Adaptability or versatility
If a wafer inverter mechanism is added to enable substrate inversion, then standard front-side systems can inspect backside, but the device complexity increases
Solution Approach 1:
The wafer inverter is designed as a universal interface that integrates with existing SEMI standard handling systems. By providing a standardized rotation mechanism that works with conventional front-side equipment, it enables multiple functions (frontside inspection, backside inspection, substrate queuing) using a single integrated system rather than requiring separate specialized equipment.
3Reliability
If edge grip mechanisms with reciprocating gripping members are used, then substrate grasping is secure and positive, but the mechanism complexity increases
Solution Approach 1:
The gripping mechanism uses dynamic reciprocating motion of the gripping members to achieve secure substrate grasping. The members move between engaged and disengaged positions, allowing for reliable substrate acquisition and release. This dynamic approach provides firm holding during inversion while maintaining ease of operation through automated reciprocating motion.
Data Source
AI summary
A BOLTS compatible module includes a support mechanism for gripping a wafer. The support mechanism is coupled to a rotary mechanism for rotating the support mechanism with a wafer grip therein. The rotary mechanism is coupled to the module and capable of at least 180° of rotation.