Wafer Component Inversion Control for Mounting Head Interference
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Solution Overview
Problem
The integration of a wafer component supply device with an inverting mechanism and conveyor in component mounting machines increases device size and operation time, leading to reduced production efficiency due to potential interference with the mounting head and feeder components, and longer processing times for wafer component inversion and mounting.
Innovation Solution
A system that controls the wafer component supply device and feeder operations within a component mounting machine, utilizing a vertical movement mechanism and coordinated operation timing to prevent head interference, allowing simultaneous or overlapping operations for wafer and feeder component processing, and incorporating image recognition and a knock-up mechanism for efficient component suction.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a wafer component supply device includes an inverting mechanism and conveyor to invert and convey wafer components, then the wafer component can be properly oriented for mounting, but the device size is increased and operation time is lengthened
Solution Approach 1:
The patent combines the inverting mechanism and conveyor into an integrated unit where the supply head performs both suction and inversion functions. The supply head includes an inversion mechanism that inverts the wafer component immediately after suction, eliminating the need for a separate conveyor system. This merging reduces device size while maintaining the ability to properly orient wafer components for mounting.
Solution Approach 2:
The supply head is designed with multi-functionality, serving both as a suction device and an inversion device. The same supply head that sucks the wafer component from the dicing sheet also performs the inversion operation, and can subsequently convey the inverted component to the mounting head. This universal design reduces the number of separate components needed, thereby reducing overall device complexity.
2Productivity
If the supply head and mounting head operate simultaneously to improve productivity, then production efficiency increases, but interference or collision between heads occurs
Solution Approach 1:
The patent implements dynamic control of the supply head and mounting head operations. The control device dynamically adjusts the timing and positioning of both heads based on real-time operational status. The supply head can move to different positions (first position for suction, second position for inversion, third position for conveyance) and the control device coordinates these movements with the mounting head's operations to prevent interference while maintaining high productivity.
Solution Approach 2:
The control device uses feedback mechanisms to monitor the positions and operational states of both the supply head and mounting head. Based on this feedback, the control device dynamically adjusts the operation timing and sequences to ensure simultaneous operation without collision. The feedback system detects potential interference scenarios and adjusts head movements or timing to prevent conflicts, maintaining both productivity and operational reliability.
3Device complexity
If the wafer component is inverted by the supply head to reduce device size, then device complexity decreases, but the height position of the wafer component must be precisely controlled
Solution Approach 1:
The patent replaces complex mechanical height adjustment mechanisms with a control system that precisely controls the vertical movement of the supply head. Instead of using multiple mechanical stages or complex linkages to adjust height, the system uses controlled vertical movement of the supply head to the predetermined third position, where the inverted wafer component's height automatically corresponds to the suction position of the mounting head. This substitution of mechanical complexity with controlled movement maintains precision while reducing device size.
Data Source
AI summary
A wafer component supply device supplying a wafer component and a feeder, such as a tape feeder supplying an electronic component, are set in a component mounting machine. When the wafer component is to be inverted and mounted on a circuit substrate, the wafer component supply device allows the wafer component present on an inverted supply head to be sucked by a mounting head of the component mounting machine at a position where the supply head and a stage are moved down by a vertical movement mechanism. An order of an operation for inverting the wafer component and mounting the wafer component on the circuit substrate and an operation for mounting the feeder component on the circuit substrate is set so that the supply head and the mounting head do not interfere with each other; and an operation for moving down the supply head and the stage, allowing the wafer component to be sucked by the supply head, and inverting the wafer component is performed so as to overlap with an operation for sucking and mounting the feeder component by the mounting head.