Wafer Jointing Means Alignment and Bonding

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Solution Overview

Problem

Existing methods for applying sheet-like jointing means to wafers face issues with blade wear and strip formation during cutting, leading to downtime and contamination, and laser cutting results in bead formation hindering precise bonding.

Innovation Solution

A device and method that aligns and contacts a sheet-like jointing element with the wafer without cutting, using optical detection for precise alignment and a chuck system to move and position the jointing element, eliminating the need for blade-based cutting and minimizing waste.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a blade is used for cutting the film along the edge of the carrier wafer, then the film can be cut to size, but the blade becomes blunt quickly causing high material wear and equipment downtime

Engineering Contradiction:

Improvecutting precisionVSAvoidequipment downtime

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The patent removes the cutting operation entirely from the process. Instead of using a blade to cut the jointing means along the wafer edge, the film is pre-cut to match the wafer dimensions before application, eliminating blade wear and replacement downtime while maintaining precision through pre-manufactured components

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The jointing means is pre-cut and pre-shaped to match the exact dimensions of the carrier wafer before the application process. This preliminary preparation eliminates the need for on-site cutting operations, reducing equipment downtime and maintaining consistent cutting precision through factory-controlled manufacturing

Inventive Principle:

Principle #10Preliminary action

2Productivity

If a laser beam is used for cutting the film along the edge, then cutting speed is improved, but a projecting border or bead is formed which hinders precise bonding

Engineering Contradiction:

Improvecutting speedVSAvoidbonding precision

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The patent eliminates the laser cutting step entirely from the process. By pre-cutting the jointing means to the exact wafer dimensions before application, the method avoids laser-induced bead formation while maintaining high productivity through efficient pre-manufacturing and direct application

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The jointing means is pre-cut and pre-shaped to match the exact dimensions of the carrier wafer before the application process. This preliminary preparation eliminates the need for on-site laser cutting, avoiding bead formation and maintaining bonding precision while preserving productivity through factory-controlled manufacturing

Inventive Principle:

Principle #10Preliminary action

3Manufacturing precision

If cutting is performed along the wafer edge, then the film is sized to the wafer, but film stripes with inaccurate cutting are formed that hang out from the wafer face and can contaminate the surface

Engineering Contradiction:

Improvefilm sizing accuracyVSAvoidwafer contamination

Core Design Contradiction:

Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The patent removes the cutting operation that creates inaccurate film edges and hanging stripes. By pre-cutting the jointing means to precise dimensions before application, the method eliminates the source of contamination while maintaining accurate film sizing through controlled pre-manufacturing

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The jointing means is pre-cut and pre-shaped to match the exact dimensions of the carrier wafer before the application process. This preliminary preparation ensures accurate sizing and clean edges, preventing hanging stripes and surface contamination while maintaining manufacturing precision through factory-controlled manufacturing

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach reduces material wear, eliminates strip formation, and ensures precise bonding without interrupting production, maintaining a sterile environment and allowing for various wafer sizes and shapes to be processed efficiently.

Implementation Method 1

optical detection means, which detect the position of the sheet-like jointing element and the wafer in a contactless manner

Methodology Applied

Scientific EffectOptical detection:

Implementation Method 2

a first device for receiving and, as necessary, moving the sheet-like jointing element, wherein the first device can be a chuck which receives the sheet-like jointing element, for example by means of suction

Methodology Applied

Scientific EffectSuction: Suction

Data Source

PatentUS8500930B2Device and method for the application of a sheet-like jointing means onto a contact area of a wafer

Publication Date: 2013.08.06 THALLNER ERICH

AI summary

The invention concerns a device and a corresponding method for the jointing of wafers along their corresponding surfaces.