Semiconductor Wafer Junction Repair by Local Laser Rebonding
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Solution Overview
Problem
The existing joining process for semiconductor wafers results in unjoined parts due to the presence of holding parts, leading to unstable behaviors, peeling, or insufficient pressure, which can render these parts useless or affect subsequent machining processes.
Innovation Solution
A joining correction method using laser light is applied to unjoined parts to correct the joined state, limiting heat exposure to these areas and preventing adverse effects on other parts.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stress or pressure
If a holding part is used to hold semiconductor wafers during the joining process, then the wafers can be interposed under pressure, but laser light cannot be applied to the parts held by the holding part, resulting in unjoined parts
Solution Approach 1:
The holding part is removed after the initial joining process before performing the correction process. This preliminary removal action allows laser light to be applied to previously obscured areas without interfering with the already-bonded regions, enabling complete joining coverage.
Solution Approach 2:
The holding part is extracted from the system after serving its primary function of maintaining pressure during initial joining. This extraction allows the laser beam to access and treat the unjoined parts that were previously blocked by the holding part structure.
2Manufacturing precision
If laser light is applied to correct unjoined parts, then the joined state at unjoined parts can be improved, but heat may adversely affect other parts
Solution Approach 1:
The correction process applies laser light locally only to the unjoined parts rather than uniformly across the entire wafer surface. By targeting specific deficient areas with the laser beam, the treatment achieves effective bonding correction while minimizing heat exposure to already-bonded regions and other sensitive areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the formation of a favorable joined state between semiconductor wafers even if unjoined parts occur, ensuring stable and effective bonding.
Implementation Method 1
a joining correction method using laser light is applied to unjoined parts to correct the joined state
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3
AI summary
A joining correction method corrects a joined state at an unjoined part by applying laser light to the unjoined part if the unjoined part occurs in at least a part of a joining intended site in a joining process of joining two joining targets to each other at the joining intended site set in facing surfaces of the joining targets.