Photo-Releasable Wafer Laminate for Clean Substrate Separation
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Solution Overview
Problem
Current semiconductor wafer lamination techniques face challenges in achieving easy separation of support substrates and semiconductor substrates without deformation or residue, especially during polishing, and require a release mechanism that withstands stress during processing.
Innovation Solution
A laminate structure comprising a semiconductor substrate, a light-transmissive support substrate, and an adhesive and release layer with a compound having a styrylene structure that absorbs light to facilitate easy separation and is soluble in cleaning agents, using a release agent composition with a siloxane structure for the release layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a strong adhesive force is used to withstand polishing stress, then the semiconductor wafer remains stable during polishing, but the wafer becomes difficult to remove from the support without deformation
Solution Approach 1:
The adhesive layer's properties are changed by irradiating it with light, causing a photochemical reaction that reduces its adhesive force. This allows the bonding strength to be dynamically adjusted from strong (during polishing) to weak (during removal) by changing the light irradiation parameter
Solution Approach 2:
The adhesive layer is pre-designed to contain photo-sensitive components that will undergo a chemical change when exposed to light. This preliminary preparation enables the adhesive force to be reduced on demand, facilitating easy removal after the bonding has served its purpose during polishing
2Ease of operation
If conventional release methods are used, then the semiconductor wafer can be removed from the support, but residue remains on the wafer surface requiring additional cleaning steps
Solution Approach 1:
The release layer undergoes a phase transition or chemical decomposition when irradiated with light, transforming from a solid adhesive state to a soluble or volatile state. This phase change allows the release layer to be easily removed without leaving residue on the semiconductor wafer surface
Solution Approach 2:
The release layer is designed as a separate, extractable component that can be selectively removed from the semiconductor wafer surface. By using light-irradiated decomposition, the release layer materials are extracted or decomposed into soluble products that can be cleaned away, leaving no harmful residue
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables easy separation of substrates after light irradiation and effective cleaning of the release layer residue, ensuring minimal deformation and efficient processing of semiconductor substrates.
Implementation Method 1
the release layer absorbs light emitted from the support substrate side
Implementation Method 2
a compound having: a first structure that absorbs the light and contributes to facilitating the semiconductor substrate and the support substrate to be released by absorbing the light
Data Source
AI summary
A laminate includes: a semiconductor substrate; a light-transmissive support substrate; and an adhesive layer and a release layer disposed between the semiconductor substrate and the support substrate. The release layer is formed of a release agent composition containing a compound having: a first structure that absorbs the light and contributes to facilitating the semiconductor substrate and the support substrate to be released by absorbing the light; and a siloxane structure as a second structure.