Wafer Processing Laminate with Composite Adhesive Layers
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Solution Overview
Problem
Conventional temporary adhesive materials for wafer processing lack sufficient durability, heat resistance, and uniformity for steps like TSV formation and CVD processes, and are inefficient in delamination, limiting the productivity of thin wafers.
Innovation Solution
A complex temporary adhesive material layer comprising a thermosetting siloxane polymer layer, a thermosetting polymer layer, and a thermoplastic resin layer, which provides strong adhesion, uniform film thickness, and easy delamination, while maintaining heat resistance and compatibility with TSV and CVD processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a conventional organic resin film tape is used for protecting the wafer back surface during grinding, then the wafer can be protected from breakage, but the tape lacks sufficient strength and heat resistance for subsequent TSV formation and wiring steps
Solution Approach 1:
The patent employs a composite adhesive layer structure consisting of a first adhesive layer (providing strong bonding to the substrate), a second adhesive layer (providing release functionality), and optionally a third adhesive layer (providing additional protection or functionality). This composite structure combines the benefits of different materials to achieve both strong adhesion during processing and controlled release afterward, while maintaining heat resistance and chemical stability required for TSV formation and wiring steps.
2Strength
If a temporary adhesive layer with strong bonding is used to bond the substrate to the support, then the substrate can be securely held during processing, but the delamination process becomes difficult and time-consuming
Solution Approach 1:
The adhesive system is segmented into multiple functional layers: a first adhesive layer that provides strong bonding to the substrate, and a second adhesive layer that provides controlled release functionality. This segmentation allows the system to achieve both strong bonding during processing and easy delamination afterward, as each layer performs its specific function independently.
Solution Approach 2:
The patent utilizes parameter changes in the adhesive layers' properties - the first adhesive layer maintains strong bonding at processing temperatures, while the second adhesive layer is designed to change its adhesion parameters (become less adhesive) under specific conditions such as heating or chemical treatment, enabling rapid delamination without compromising the bonding strength during the processing steps.
3Ease of operation
If conventional adhesive materials are used that can be delaminated by chemical dissolution, then the substrate can be separated from the support, but the delamination process takes a very long time and is difficult to apply to actual manufacturing
Solution Approach 1:
The patent employs phase transition mechanisms in the adhesive layers - particularly the second adhesive layer that is designed to undergo phase changes (such as melting or softening) at specific temperatures, enabling rapid delamination through thermal treatment rather than slow chemical dissolution. This dramatically reduces delamination time and improves manufacturing productivity.
4Strength
If a temporary adhesive layer is used to bond the substrate to the support, then the substrate can be held securely during back surface grinding and TSV formation, but the adhesive layer cannot form a uniform film on heavily stepped substrates
Solution Approach 1:
The patent applies local quality by designing different adhesive layers with different properties optimized for their specific functions and locations. The first adhesive layer has properties optimized for strong bonding to the substrate surface, while the second adhesive layer has properties optimized for controlled release. This allows each layer to perform its function effectively despite variations in substrate topography, achieving both bonding durability and film uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables the efficient manufacturing of thin wafers with improved heat resistance and uniformity, facilitating easy delamination and enhancing productivity by ensuring strong adhesion and resistance to thermal processes.
Implementation Method 1
a first temporary adhesive layer composed of a thermosetting siloxane polymer layer (A)... which has sufficient durability to bond the substrate to the support
Implementation Method 2
a third temporary adhesive layer composed of a thermoplastic resin layer (C)... it is necessary that a thin wafer can be easily delaminated from the support finally
Implementation Method 3
have excellent resistance to a thermal process for wafer such as CVD (chemical vapor deposition), enable easy delamination
Data Source
AI summary
Temporary adhesive material for wafer processing, the temporary adhesive material being used for temporarily bonding support to wafer having circuit-forming front surface and back surface to be processed, including complex temporary adhesive material layer that has first temporary adhesive layer composed of thermosetting siloxane polymer layer (A), second temporary adhesive layer composed of thermosetting polymer layer (B), and third temporary adhesive layer composed of thermoplastic resin layer (C), wherein the polymer layer (A) is cured layer of composition containing (A-1) an organopolysiloxane having alkenyl group within its molecule, (A-2) an organopolysiloxane having R103SiO0.5 unit and SiO2 unit, (A-3) organohydrogenpolysiloxane having two or more Si—H groups per molecule, and (A-4) platinum-based catalyst. There can be provided a wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin wafer using the same which facilitate temporary adhesion and delamination, has excellent CVD resistance, and increasing productivity of thin wafers.