Wafer Laminate Semi-Curing to Reduce Warping and Resin Residue

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Solution Overview

Problem

Existing methods for planarizing semiconductor wafers using resin coating and grinding suffer from warping due to resin curing shrinkage, leading to handling issues and resin residue, which complicates subsequent processing steps.

Innovation Solution

A method involving semi-curing a resin with an external stimulus to form a laminate with a substrate and film, followed by improving the resin's curing degree and then peeling it off, reducing warping and residue.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Shape

If liquid resin is cured by ultraviolet ray to coat the wafer surface, then the wafer surface becomes flat, but warping occurs due to shrinkage during curing

Engineering Contradiction:

Improvewafer surface flatnessVSAvoidwafer warping

Core Design Contradiction:

ShapeVSStability of the object's composition

Solution Approach 1:

The patent applies preliminary action by semi-curing the resin before the wafer is fully processed. The resin is irradiated with ultraviolet rays to achieve partial curing (semi-curing state) before the grinding and planarization steps are completed. This preliminary semi-curing prevents excessive shrinkage and warping while allowing the surface to be sufficiently set for handling during subsequent processing steps.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent applies parameter changes by controlling the curing degree of the resin through controlled ultraviolet irradiation. Instead of full curing, the resin is irradiated to achieve a specific semi-cured state with optimized curing degree. This parameter control allows the resin to provide sufficient adhesion and surface stability while minimizing shrinkage-induced warping. The curing degree is adjusted as a key parameter to balance surface flatness and warping prevention.

Inventive Principle:

Principle #35Parameter changes

2Stability of the object's composition

If the curing degree of the resin is lowered to reduce warping, then warping is reduced, but the fixing force between resin and film is reduced, causing resin to remain on the wafer

Engineering Contradiction:

Improvewafer warpingVSAvoidfixing force between resin and film

Core Design Contradiction:

Stability of the object's compositionVSStrength

Solution Approach 1:

The patent applies parameter changes by precisely controlling the curing degree of the resin through controlled ultraviolet irradiation. The resin is irradiated to achieve a specific semi-cured state with optimized curing degree. This parameter control allows the resin to provide sufficient adhesion and surface stability while minimizing shrinkage-induced warping. The curing degree is adjusted as a key parameter to balance surface flatness and warping prevention.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The patent applies continuity of useful action by implementing a multi-step irradiation process. The resin undergoes semi-curing during the initial coating phase, then receives additional irradiation after the grinding step to improve the curing degree further. This continuous and staged irradiation ensures the resin achieves sufficient curing for easy peeling while maintaining adhesion strength throughout the entire processing sequence.

Inventive Principle:

Principle #20Continuity of useful action

3Strength

If the resin is fully cured to ensure strong adhesion, then the fixing force is improved, but warping occurs due to shrinkage

Engineering Contradiction:

Improvefixing force between resin and filmVSAvoidwafer warping

Core Design Contradiction:

StrengthVSStability of the object's composition

Solution Approach 1:

The patent applies preliminary action by semi-curing the resin before the wafer is fully processed. The resin is irradiated with ultraviolet rays to achieve partial curing (semi-cured state) before the grinding and planarization steps are completed. This preliminary semi-curing prevents excessive shrinkage and warping while allowing the surface to be sufficiently set for handling during subsequent processing steps.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

Inventive Principle:

Principle #20Continuity of useful action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Reduces warping and facilitates easy resin removal from the substrate, minimizing processing complications and ensuring smooth subsequent steps.

Implementation Method 1

a laminate by semi-curing a resin (4) that cures due to an external stimulus by applying the external stimulus to the resin

Methodology Applied

Scientific EffectPhotopolymerisation: Photopolymerisation

Implementation Method 2

the liquid resin is irradiated with the ultraviolet ray while the liquid resin is spread on the one surface side of the wafer to cure the liquid resin

Methodology Applied

Scientific EffectPhotochemical reaction: Photopolymerisation

Data Source

PatentUS20250367861A1Method for processing substrate

Publication Date: 2025.12.04 DISCO CORP

AI summary

A method for processing a substrate includes forming, in a state where the substrate and a film are integrated through a resin that cures due to an external stimulus, a laminate by semi-curing the resin by applying the external stimulus to the resin; processing the laminate; improving a curing degree of the resin by applying the external stimulus to the resin after processing of the laminate; and peeling the resin and the film from the substrate after improving of the curing degree.