Wafer Backside Laser Marking With Non-Overlapping Character Paths

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Solution Overview

Problem

Existing laser marking technologies for semiconductor wafers face challenges in efficiently forming alphanumeric characters on the wafer backside without excessive surface depression overlap, which can lead to surface vulnerabilities and degradation.

Innovation Solution

A method and system that control the laser tip to point to a series of target positions along a path, selectively applying light pulses to form surface depressions while avoiding overlapping start points of previously-formed segments, using controlled on_delay and off_delay periods to manage laser pulsing.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If laser pulses are applied continuously along a path to form alphanumeric characters, then marking efficiency is improved, but surface depression overlap increases causing surface vulnerabilities

Engineering Contradiction:
Improvemarking efficiencyVSAvoidsurface integrity
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The laser marking path is divided into multiple linear segments with distinct start and end points. The system calculates and enforces non-overlapping constraints between consecutive segments, ensuring that the start point of each segment does not overlap with the start point of previously formed segments. This segmentation approach maintains high marking efficiency while preventing surface depression overlap that would compromise surface integrity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The system performs preliminary calculation of the laser path segments and their start points before actual marking begins. By pre-determining the segment geometry and verifying non-overlapping conditions in advance, the system ensures that surface integrity is maintained while preserving marking efficiency during the actual laser application process.

Inventive Principle:
Principle #10Preliminary action

2Manufacturing precision

If laser path segments are extended to cover the entire character, then marking completeness is improved, but surface depression overlap increases

Engineering Contradiction:
Improvecharacter formation completenessVSAvoidsurface vulnerability
Core Design Contradiction:
Manufacturing precisionVSObject-affected harmful factors

Solution Approach 1:

The character marking path is segmented into multiple linear segments, each with defined start and end points. The system ensures that while segments collectively cover the entire character for complete formation, the start point of each segment is positioned to avoid overlapping with previous segment start points, thus preventing harmful surface depression accumulation.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The system adjusts the parameter of segment start point positioning to ensure non-overlapping conditions. By changing the spatial parameters of where each segment begins, the system achieves complete character coverage without creating overlapping surface depressions that would cause surface vulnerability.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Reduces excessive surface depression depth and vulnerability by minimizing overlapping pulses, ensuring precise and robust formation of alphanumeric characters on semiconductor wafers.

Implementation Method 1

enabling the laser to selectively apply light pulses to form a surface depression corresponding to each light pulse

Methodology Applied
Scientific EffectLaser ablation: Laser Ablation

Data Source

PatentUS20250326050A1Integrated circuit laser marking system
Publication Date: 2025.10.23 TEXAS INSTRUMENTS INC
  • US20250326050A1 patent drawing
  • US20250326050A1 patent drawing
  • US20250326050A1 patent drawing

AI summary

A method forms an integrated circuit by forming circuitry relative to a first side of a semiconductor layer and an alphanumeric character having a plurality of linear segments on a surface comprising, or fixed relative to, a second side of the semiconductor layer opposite the first side. The forming of an alphanumeric character comprises controlling a tip of a laser to point to a series of laser pulse target positions along a path of the surface while enabling the laser to selectively apply light pulses to form a surface depression corresponding to each light pulse and along at least a portion of the path, the path traversing from a first linear segment of the plurality of linear segments to a final linear segment of the plurality of linear segments, without any segment of the plurality of segments having a start point overlapping a start point of a previously-formed segment.