Wafer Laser Condensing Point Control for Faster Layer Separation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for forming modification layers on semiconductor wafers are inefficient, leading to reduced productivity and throughput in the wafer separation process due to the sequential formation of modification layers, which prolongs the processing time.
Innovation Solution
A wafer processing system equipped with a modifying apparatus that uses a spatial light modulator to simultaneously form multiple condensing points within the wafer, allowing for the simultaneous formation of internal and peripheral modification layers, thereby improving the efficiency of the separation process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If sequential formation of modification layers is used, then processing simplicity is maintained, but productivity and throughput are reduced due to prolonged processing time
Solution Approach 1:
The laser beam is divided into multiple independent condensing points that can be simultaneously formed at different positions within the wafer. The spatial light modulator segments the single laser beam into multiple focal points, allowing parallel formation of modification layers at different depths and positions, thereby increasing throughput without requiring multiple laser sources
Solution Approach 2:
The patent introduces the spatial dimension of light modulation by using a spatial light modulator to create multiple condensing points in different spatial positions and depths within the wafer. This transforms a single-point sequential processing approach into a multi-point simultaneous processing approach by utilizing the three-dimensional spatial capabilities of optical focusing
2Loss of time
If multiple condensing points are formed simultaneously, then processing time is reduced and productivity is improved, but control precision and arrangement accuracy become more difficult
Solution Approach 1:
The system incorporates feedback control mechanisms where the controller monitors and adjusts the positions and parameters of multiple condensing points in real-time. The spatial light modulator can be dynamically controlled to maintain precise spacing and arrangement of condensing points despite variations in wafer position, rotation speed, or laser parameters, ensuring consistent modification layer formation
Solution Approach 2:
The patent employs dynamic adjustment capabilities where the spatial light modulator and laser system can adaptively modify condensing point positions, spacing, and formation parameters during the processing operation. This allows the system to maintain precision while operating at higher speeds, compensating for any deviations that occur during rapid simultaneous multi-point processing
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the throughput and productivity of the wafer separation process by enabling the simultaneous formation of multiple modification layers, reducing processing time and improving the efficiency of wafer separation.
Implementation Method 1
a modifying device configured to form multiple condensing points along a plane direction of the processing target object by radiating laser light to an inside of the processing target object
Implementation Method 2
forming the condensing points by radiating the laser light to the inside of the processing target object
Data Source
AI summary
A processing apparatus includes a controller configured to control an operation of forming condensing points in a processing target object. In forming the condensing points by radiating a laser light to an inside of the processing target object periodically from a modifying device while rotating the processing target object held by a holder relative to the modifying device by a rotating mechanism and, also, by moving the modifying device in a diametrical direction relative to the holder by a moving mechanism, the controller controls a number and an arrangement of the condensing points, which are simultaneously formed at different positions in a plane direction of the processing target object, based on a relative rotation number of the processing target object and a radiation pitch of the laser light.