Wafer Test Machine Laser Probe Card Cleaning
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Solution Overview
Problem
Conventional wafer test machines face reliability issues due to contaminant accumulation on probe cards, which requires mechanical cleaning, leading to probe wear and necessitates separation from the test chamber.
Innovation Solution
A wafer test machine equipped with a laser cleaning apparatus that uses a laser beam to clean the probe card within the chamber, allowing for non-contact cleaning and minimizing probe wear, along with a contaminant removal unit for suctioning particulate contaminants.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If mechanical cleaning with a cleaning pad is used, then the probe card can be cleaned, but the probe wears out due to mechanical contact
Solution Approach 1:
The patent replaces the mechanical cleaning system (cleaning pad contacting probe) with a laser-based cleaning system. The laser beam irradiates the probe card to remove contaminants without mechanical contact, thereby eliminating wear on the probes while maintaining cleaning effectiveness.
Solution Approach 2:
The patent introduces a laser beam as an intermediary between the cleaning function and the probe card. Instead of direct mechanical contact between the cleaning pad and probe, the laser beam serves as the mediating element that transfers cleaning energy without causing wear.
2Ease of manufacture
If the probe card is separated from the wafer test machine for cleaning, then cleaning can be performed, but the cleaning process becomes complex and time-consuming
Solution Approach 1:
The patent merges the cleaning function with the wafer test machine by integrating the laser cleaning apparatus into the test chamber. This allows the probe card to be cleaned in-situ without separation, combining two previously separate processes (testing and cleaning) into a single integrated system.
Solution Approach 2:
The probe card cleaning is performed automatically within the test chamber using the laser cleaning apparatus, eliminating the need for manual separation and external cleaning processes. The system serves itself by performing maintenance (cleaning) during its own operation cycle.
3Reliability
If conventional mechanical cleaning is used, then cleaning can be performed, but contaminants may be redistributed or not fully removed
Solution Approach 1:
The patent replaces mechanical cleaning action with laser irradiation. The laser beam removes contaminants through ablation or vaporization without the mechanical forces that cause contaminant redistribution, achieving more effective and cleaner removal.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laser cleaning system effectively cleans the probe card without mechanical contact, reducing wear and maintaining the probe's integrity, while the contaminant removal unit ensures thorough cleaning, enhancing the reliability and efficiency of the wafer testing process.
Implementation Method 1
a laser cleaning apparatus for cleaning the probe card by a laser beam in the chamber
Implementation Method 2
a contaminant removing unit for suctioning and removing particulate contaminants separated from the probe card during laser cleaning
Data Source
AI summary
A wafer test machine is disclosed. The wafer test machine comprises a main body having a chamber defined therein, wherein a probe card is disposed at an upper portion of the chamber; a chuck for fixing a wafer in the chamber; a moving unit for moving the chuck in the chamber, thus making a contact between the probe card and the wafer; and a laser cleaning apparatus for cleaning the probe card in the chamber using a laser beam, when the probe card does not contact the wafer.