Wafer Laser Processing Preview for Modified Region and Crack Control

Solution Overview

Problem

Existing inspection devices for semiconductor wafers face challenges in efficiently determining optimal processing conditions for laser processing, requiring repeated adjustments and lacking a straightforward method for users to visualize and correct processing outcomes.

Innovation Solution

An inspection device equipped with an irradiation unit, a display unit, and a control unit that estimates processing results, including modified regions and cracks, based on set processing conditions. The device displays an estimated processing result image, allowing users to visualize and adjust processing conditions efficiently.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If repeated laser processing treatment is performed while user adjusts processing conditions, then appropriate processing conditions can be derived, but time consumption and operational complexity increase

Engineering Contradiction:

Improveprocessing conditions accuracyVSAvoidtime for determining processing conditions

Core Design Contradiction:

Manufacturing precisionVSLoss of time

Solution Approach 1:

The system performs preliminary simulation of laser processing results before actual processing. The control unit calculates estimated processing results including modified region positions and crack extension based on set processing conditions, allowing users to predict outcomes without performing repeated actual laser processing trials.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The system creates a visual copy or representation of the expected processing result through the estimated processing result image. This image depicts the wafer with predicted modified regions and crack patterns, allowing users to review and adjust conditions based on the simulation rather than physical trial-and-error.

Inventive Principle:

Principle #26Copying

2Manufacturing precision

If repeated laser processing treatment is performed while user adjusts processing conditions, then appropriate processing conditions can be derived, but operational ease decreases

Engineering Contradiction:

Improveprocessing conditions accuracyVSAvoidease of determining processing conditions

Core Design Contradiction:

Manufacturing precisionVSEase of operation

Solution Approach 1:

The system creates a visual copy or representation of the expected processing result through the estimated processing result image. This image depicts the wafer with predicted modified regions and crack patterns, allowing users to review and adjust conditions based on the simulation rather than physical trial-and-error.

Inventive Principle:

Principle #26Copying

Solution Approach 2:

The system provides visual feedback through the estimated processing result image that shows users what the processing outcome will be under current conditions. This feedback loop allows users to adjust conditions and immediately see predicted results, making the optimization process more intuitive and easier to operate.

Inventive Principle:

Principle #23Feedback

3Ease of operation

If no visual estimation of processing results is provided, then device complexity is reduced, but user ability to determine and correct processing conditions is impaired

Engineering Contradiction:

Improveuser ability to determine processing conditionsVSAvoidcomplexity of processing condition determination

Core Design Contradiction:

Ease of operationVSDevice complexity

Solution Approach 1:

The system creates a visual copy or representation of the expected processing result through the estimated processing result image. This image depicts the wafer with predicted modified regions and crack patterns, allowing users to review and adjust conditions based on the simulation rather than physical trial-and-error.

Inventive Principle:

Principle #26Copying

Solution Approach 2:

The system replaces physical trial-and-error laser processing with computational simulation and visual display. The control unit performs calculations to predict processing results and displays them graphically, substituting mechanical/physical experimentation with computational modeling and visual information presentation.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables users to efficiently determine and adjust processing conditions, facilitating accurate and desired processing outcomes by providing a visual interface for monitoring and correcting processing results.

Implementation Method 1

irradiating a wafer with laser light from the other surface side of the semiconductor substrate in order to cut a wafer

Methodology Applied

Scientific EffectLaser heating: Laser

Implementation Method 2

forming a plurality of rows of modified regions inside a semiconductor substrate... a crack extending from the modified region

Methodology Applied

Scientific EffectThermal stress: Thermal Shock

Data Source

PatentUS12272577B2Inspection device and processing system

Publication Date: 2025.04.08 HAMAMATSU PHOTONICS KK

AI summary

An inspection device includes a laser irradiation unit irradiating a wafer with laser light, a display displaying information, and a control unit. The control unit is constituted to execute deriving of an estimated processing result including information a modified region and a crack extending from the modified region formed on the wafer when the wafer is irradiated with the laser light by the laser irradiation unit on the basis of set recipes (processing conditions), and controlling the display so as to display an estimated processing result image depicting both a graphic image of the wafer and a graphic image of the modified region and the crack in the wafer in consideration of positions of the modified region and the crack in the wafer derived as the estimated processing result.